Why Choose Our Electrolytic Copper Foil？
- Over a decade of expertise in EMI material processing.
- Approximately 15,000m2 electrolytic copper foil manufacturing factory, with a monthly production capacity of around 2,000 m2.
- Offer comprehensive services, including solution design, precision cutting, and assembly tailored to your product specifications.
- Adheres strictly to Total Quality Management(TQM) principles to offer consistent quality throughout high-volume production.
- Certified to ISO 9001:2008, ISO 14001, IATF 16949, and ISO 45001.
Your Reliable Electrolytic Copper Foil Supplier
As an experienced manufacturer of electrolytic copper foil with a comprehensive in-house testing system, GALLOP INNOTEK provides stable-quality electrolytic copper foil for electromagnetic interference shielding and grounding applications across multiple industries. Our electrolytic copper foil delivers reliable performance and also brings customisable specifications, including thickness and surface treatment. With approximately 22 production lines, GALLOP INNOTEK achieves efficient mass production capacity and consistent supply assurance, positioning us as your long-term, dependable partner.
Features of Electrolytic Copper Foil
Electrolytic copper foil has very high electrical conductivity and low resistance, making it effectively reflect EMI.
Copper is an excellent thermal conductor (approximately 400 W/m·K), helping in heat dissipation.
GALLOP INNOTEK’s IR detection system allows electrolytic copper foil thickness to meet stringent tolerances.
Roughened / Treated surface, heat treatment and anti-oxidation treatment are all available options.
Suitable for lamination, die-cutting, coating, laminating and slitting, and can be readily integrated into automated production lines.
Electrolytic copper foil offers lower initial costs than rolled copper foil and provides greater cost-effectiveness.
Electrolytic copper foil combines high performance with good lightness, making it a good choice for applications with stringent weight constraints.
Electrolytic copper foil has high hardness with flexibility, allowing resistance to impact and pressure while reducing the risk of breakage.
Customization Capability
GALLOP INNOTEK offers customisable electrolytic thicknesses ranging from 12 to 70μm. You may also tailor shapes and dimensions to satisfy different production line requirements. We provide surface treatments, including plating, oxidation resistance, and roughening for both single and double sides. Furthermore, we can pre-form materials into electrolytic coils, strips, die-cut parts, and other formats for convenient subsequent processing. Should you require it, we can provide satisfactory services from design to pre-assembly.
High Standard Quality Control
Electrolytic copper foil achieves a copper purity of 99.95%, delivering outstanding electrical conductivity and stable performance for your products. It also offers high strength, excellent ductility, lightweight durability, and serves as a long-term, reliable choice. Furthermore, GALLOP INNOTEK has in-house testing laboratories, rigorously enforced to comprehensive quality management guidelines to conduct tolerance and reliability testing on electrolytic copper foil, make sure high quitily electromagnetic shielding function.
Stable Supply Manufacturer
We can swiftly provide complimentary samples for both small and large-scale requirements, thereby reducing the time wasted on multiple revisions, improving delivery efficiency while controlling the budget. GALLOP INNOTEK equipment with the WMS-MES intelligent production system and traceability system. So, all electrolytic copper foil leaving the factory meets the same quality standards, and achieve stable lead time for volume orders.
Applications of Electrolytic Copper Foil
Electrolytic copper foil may be installed on the copper-clad layers, ground planes, and EMI shielding layers of PCBs and HDI boards to achieve signal flow and improve signal integrity.
You can enhance the efficiency of lithium-ion battery operation within the current collector assembly, thereby extending battery life and achieving more reliable performance.
Electrolytic copper foil can be processed into electromagnetic shielding materials(copper foil tape, etc.) for use in communications, automotive, and electronic equipment industries.
Electrolytic copper foil may be utilised in electromagnetic shielding components, heat dissipation components, and foldable screen assemblies within electronic devices.
Owing to the ease of processing and mechanical properties, it can be utilised in the construction industry for doors, windows, decorative fittings, and other finishing applications.
Electrolytic copper foil is one type of copper foil. Alongside this, there is also rolled copper foil. Electrolytic copper foil represents a highly cost-effective choice.
No. Electrolytic copper foil, although it has excellent thermal conductivity that helps heat dissipation from thermal components, does not fill gaps and is not a thermal interface material. Its primary application is electromagnetic shielding.
When selecting electrolytic copper foil, you must consider factors such as electrical conductivity, thickness, surface treatment, and copper purity. GALLOP INNOTEK can recommend suitable models to your product specifications, thereby avoiding time and material wastage.
Yes, electrolytic copper foil can be made with conductive adhesive layers to produce high-performance electromagnetic shielding tape. This can be utilised for electromagnetic shielding and grounding applications across industries such as automotive, communications, energy, and electronics.
The purity of electrolytic copper foil influences its electrical conductivity, service life and performance stability. GALLOP INNOTEK’s purity exceeds 99.95%, offering performance that will satisfy your needs.
What is Electrolytic Copper Foil?
Electrolytic copper foil is a type of copper foil produced by electrolytic deposition of copper (Cu). Owing to its ultra-high electrical conductivity, it is as a shielding material in printed circuit boards (PCBs) and battery assemblies, reflecting electromagnetic interference to achieve more accurate and reliable signal transmission. Compared to rolled copper foil, it offers lower costs and greater ease of processing. Consequently, it is frequently used to fabricate products such as electrolytic copper foil tape for EMI applications across the electronics, automotive electronics, and energy industries.
How is the Electrolytic Copper Foil Made?
Copper Dissolution and Solution Preparation
High-purity copper material is added to a highly concentrated sulphuric acid solution. Through chemical reaction and filtration, a copper sulphate electrolyte is obtained. Copper material with excessive impurities must be avoided. High-purity copper prevents impurities from affecting copper foil quality, getting electrolytic copper foil with superior performance and enhanced durability.
Electrolysis
The raw foil is manufactured by processing the obtained copper sulphate solution into copper foil via electrochemical deposition. This process requires a raw foil machine equipped with a titanium roller (cathode) and a lead-silver alloy (anode). By introducing the solution into the machine and applying direct current, raw foil forms are made at the cathode.
Surface Treatment
The produced raw foil requires surface treatment to facilitate subsequent processing and achieve more stable performance. Surface treatment methods for electrolytic copper foil can be customised according to product requirements. Roughening treatment enhances the foil’s adhesion capability, while thermal resistance treatment further prevents risks such as short circuits caused by ion migration. Anti-oxidation treatment extends its service life.
How Does Electrolytic Copper Foil Work in EMI Shielding?
Reflected Electromagnetic Waves
Electrolytic copper foil serves as a material for reflective EMI shielding. It may be used in conjunction with absorptive shielding materials such as microwave absorbers. Its high conductivity enables robust and stable signal transmission, reflecting interference electromagnetic waves generated by other equipment and blocking stray signals that might disrupt the device’s signal transmission.
Discharge and Grounding
Electrolytic copper foil not only reflects interfering electromagnetic waves but also rapidly channels excess interference into the earth by grounding and discharge, preventing coupling within the system. This further enhances the product’s electromagnetic interference shielding capability, achieving stable and reliable operation.
Electrolytic Copper Foil VS Rolled Copper Foil
Manufacturing Process
The production method for electrolytic copper foil is simpler. Roll-formed copper foil requires additional processing steps, including repeated rolling, high-temperature annealing, degreasing, and cleaning. Roll-formed copper foil can produce thinner sheets, but this requires more complex processing and greater difficulty in controlling thickness.
Surface Roughness
Rolled copper foil has a smoother surface following forging. Although subsequent roughening processes are applied, it remains smoother than electrolytic copper foil. This enables electrolytic copper foil to achieve superior adhesion compared to rolled copper foil, resulting in better bonding to substrates. However, the roughness also results in slower signal transmission efficiency and higher electrical signal loss in electrolytic copper foil.
Ductility
Owing to differences in manufacturing processes, electrolytic copper foil has lower ductility (approximately 5% to 15%) and inferior bend resistance compared to rolled copper foil. Rolled copper foil, conversely, offers superior ductility(Over 20%) and bend resistance, rendering it suitable for thinner applications.
Cost
As rolled copper foil requires more expensive processing equipment and a more complex manufacturing process, its initial cost is often higher than that of electrolytic copper foil. Consequently, rolled copper foil is a more cost-effective choice for large-scale applications.
Electrolytic copper foil primarily achieves electromagnetic shielding by reflecting electromagnetic waves. You may combine it with electromagnetic wave absorption materials in your products to obtain enhanced electromagnetic shielding capabilities.
Thicker electrolytic foil gets higher conductivity and mechanical strength, thereby enhancing electromagnetic shielding capabilities. However, it also incurs higher costs and is unsuitable for compact components. You may balance these factors when making your selection.
Roughening, oxidation resistance treatment, tin plating, and lamination are all available processing options. These treatments enhance the performance of electrolytic copper foil and facilitate subsequent processing.
