GTP-AS9770-SH UV-cured Sealing Glue

GTP-AS9770-SH is a single-component, UV-curable polyurethane/acrylate co-polymeric adhesive. This high-viscosity formulation exhibits excellent thixotropic properties and achieves rapid photopolymerization under mercury or LED UV light. Upon cure, the adhesive forms a flexible elastomeric gasket with exceptional toughness, high elongation characteristics, and superior compression set recovery performance. The cured material exhibits reliable adhesion to a broad range of electronic components and substrates, making It is well-suited for Form-in-Place (FIP) gasket applications as a direct replacement for traditional sealing gaskets. The material provides effective environmental sealing against air infiltration, dust ingress, and contaminant penetration.

Features & Benefits

• Fast cured and high work efficiency
• Flexible, resilient cured properties
• Multi-substrate adhesion capability
• Low hardness and good physical properties
• Lightweight and strong adhesion

Typical Applications

• PCB Component Encapsulation & Sealing
• Temporary Surface Protection
• Form-in-Place (FIP) / Cure-in-Place (CIP) Gaskets

Remarks:

1. Shelf-life can be 6 months in original container @ 8-28°C in UV-opaque packaging
2. Available packaging: 30cc syringe, 100cc/1L cartridge or other options upon request

Application Instruction Note

CURING CONDITIONS

This product exhibits rapid photopolymerization under UV irradiation. Cure rate is dependent on multiple process variables including film thickness, UV intensity, working distance, and substrate optical properties.

Recommended Curing Parameters:

• UV Source: Mercury vapor lamp or LED UV system
• Exposure Time: 3-30 seconds
• Process Variables: Irradiation time is influenced by:
• Application thickness (bond line/film thickness)
• UV intensity (mW/cm²)
• Lamp-to-substrate distance
• Substrate UV transmittance characteristics

USE AND STORAGE

• Application Guidelines: This product must be dispensed using black (UV-opaque) tubing systems. Substrates to be sealed or bonded must be clean, dust-free, degreased, and completely dry. When bonding temperature-sensitive materials, pre-cool components to prevent thermal damage during application.
• Clean-up and Contamination Control: Excess uncured adhesive after positioning may be removed using appropriate organic solvents such as IPA (isopropyl alcohol) or MEK (methyl ethyl ketone). Never return unused material to original packaging to prevent cross-contamination.
• Dispensing Equipment Operation: When transferring material between dispensing systems, prevent introduction of contaminants and air entrapment. Bonded  assemblies must be cooled to ambient temperature before subjecting to mechanical loads.
• Storage Requirements: Do not expose product to heat sources including ovens, hot plates, heat guns, or direct sunlight. Store in cool, dry conditions with UV-light protection.
• Shelf Life and Stability: This photosensitive, thermally sensitive material requires storage in cool, dry, light-protected conditions. Shelf life: 6 months when stored at 8-28°C (46- 82°F) in UV-opaque containers. Improper storage conditions will degrade processing characteristics and cured performance properties.
• Safety Precautions: Avoid contact with eyes, skin, and clothing. Upon skin contact, wash immediately with soap and water. Launder contaminated clothing before reuse. If splashed in eyes, flush immediately with copious amounts of water and seek medical attention if irritation persists.