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GTP-CP350 Advanced Thermal Pad

Description

Based on the advanced orientation technology, GTPCP350 exhibits outstanding physical and chemical reliable performance in aspect of thermal conduction and EMI suppression performance. Owing to its vertically aligned carbon fibers, it can create an outstanding heat path across all the contact surface to achieve the most advanced cooling in structural designs. It can also be made in ultra-thin pad to optimize the thermal resistance with lower compressions.

Features & Benefits

  • Superior thermal conductivity: 35W/m.K
  • Good EMI suppression and thermal conduction
  • Low outgassing, durable aging performance
  • Low stress required for assembly
  • Good workability and ultra-thin offering
  • Wide range of thickness options
  • Cost-saving solutions

Typical Applications

  • Photovoltaic modules, IGBT modules
  • Industrial lighting and high-power LED module
  • Telecommunication equipment, 5G module units
  • Military gadgets, radar, power inverters
  • Automotive electronics

Remarks:

  1. Shelf-life can be 24 months since date of manufacture
  2. Supply form: Sheet, die-cut/kiss-cut parts or Screen-printed adhesive, etc.
  3. Standard sheet size: 120x120mm

More Details
ItemUnitGTP-CP350Standards
PHYSICALColorBlackVisual
Thicknessmm0.3-3.0ASTM D374
HardnessShore 0040-55ASTM D2240
Densityg/cc2.9ASTM D792
Elongation%≥100ASTM D412
Tensile StrengthMPa≥0.5ASTM D412
Dielectric StrengthKV/mm<1.0ASTM D149
Breakdown voltageKV/mm<1.0ASTM D149
Volume ResistivityΩ-cm1.0×10⁶ASTM D257
TGA Weight Losswt%<0.5150°C Cx24hrs
Operating Temp.°C-50 ~ 130
FlammabilityV0UL94
THERMALThermal ConductivityW/m.K35ASTM D5470
Thermal impedance @ 10psi / 1mm°C-in2/W0.155ASTM D5470
Thermal impedance @ 20psi / 1mm°C-in2/W0.14ASTM D5470

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