GTP-FIP080NS Non-Silicone Thermal Gel
Description
GTP-FIP080NS is a fully cured dispensable thermally conductive silicone free gap filler, which can help relieve the stress upon the sensitive components and is specially
designed for silicone-sensitive applications with excellent insulation performance and heat resistance. It helps eliminate time-consuming hand assembly, decreasing installation, decrease installation cost and reduce customer manufacturing and purchasing(logistical) complexity. In addition, it requires no mixing or curing which will provide superior design flexibility.
Features & Benefits
- Good thermal conductivity: 8.0W/m.K
- Good insulation, no siloxane volatilization
- Easily dispensable, fully-cured / no pump out
- Low thermal impedance
- Ultra-low compression force
- High tack surface and reworkable
- Cost-saving solutions
Typical Applications
- Mobile phones/tablets
- Memory modules, semiconductors
- Power supplies, UPS
- Telecommunication equipment, 5G module units
- RFI filters, automotive electronic control units (ECU)
- Optoelectronic transceiver
- Medical equipment, camera, surveillance equipment
Remarks:
- Shelf-life can be 12 months since date of manufacture
- Supply form: 30/100/300/500cc syringe, 25gallons pail
- application methods: automatic dispensing, stencil printing
More Details
- Data Sheet
| Item | Unit | GTP-FIP080NS | Standards | |
| PHYSICAL | Color | – | Grey | Visual |
| 1K or 2K part | – | 1K | – | |
| Flow rate @ 0.6Mpa | g/min | 15±5 | GB/T29755-2013 | |
| Density | g/cc | 3.6 | ASTM D792 | |
| Min Bondline thickness | mm | 0.1 | Gallop | |
| Coeff. of Thermal Expansion (CTE) | ppm/K | 160 | ASTM E831 | |
| Dielectric Strength | KV/mm | >6 | ASTM D149 | |
| Dielectric Constant @ 1MHz | – | 6 | ASTM D150 | |
| Volume Resistivity | Ω-cm | 1.0×10¹³ | ASTM D257 | |
| TGA Weight Loss | wt% | <0.3 | 150°Cx24hrs | |
| Operating Temp. | °C | -50 ~ 150 | – | |
| ROHS/REACH | – | Pass | SGS | |
| THERMAL | Thermal Conductivity | W/m.K | 8 | ASTM D5470 |
| Thermal impedance @ 10psi / 1mm | °C-in²/W | 0.131 | ASTM D5470 | |
| Thermal impedance @ 20psi / 1mm | °C-in²/W | 0.105 | ASTM D5470 |
