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GTP-PCM140-LH PCM Heat Absorbing Materials

Description

GTP-PCM140-LH is a non-silicon phase change material with an organic cross-linked network structure, offering high latent heat (≥140 J/g), excellent stability, insulation, and thermal conductivity. It absorbs heat at a design temperature of 37 or 43°C, providing efficient thermal management for temperature-sensitive and high-power devices by delaying temperature rise. The material has high mechanical strength and flexibility after heat absorption, ensuring interface compatibility and effective heat transfer. It can be processed into sheets of varying thickness or molded into custom shapes for various applications.

Features & Benefits

  • High latent heat≥140J/g
  • Good insulation and high reliability
  • Available for modified PCM transition temperature
  • Softening surface and lower thermal impedance after absorbing heat
  • Customizable for molding structures according to specific drawings

Typical Applications

  • Temperature control for battery cell modules
  • Wearable devices
  • Medical devices
  • Recyclable heat and utilization
  • Cold-chain applications

Remarks:

  1. Shelf-life can be 12months since date of manufacturing
  2. Storage condition: 0-35°C & RH≤65%
  3. Supply form: in sheets or molding parts etc.
More Details
ItemUnitGTP-PCM140-LHStandards
PHYSICALColorFloral RedVisual
HardnessShore A85 Shore 00(40°C)
70 Shore A(20°C)
ASTM D2240
AdhesiveOptional (Pre-laminated with CU/Graphite foil)
Densityg/cc1.2ASTM D792
Elongation strengthMpa1.5ASTM D412
Elongation at break%38ASTM D412
Dielectric StrengthKV/mm>10.0ASTM D149
Breakdown voltageKV/mm>11.0ASTM D149
Volume ResistivityΩ-cm1.0×1015ASTM D257
TGA Weight Losswt%<1.0150°
Cx24hrs
Operating Temp.-40~100(Long-term)
-50~125 (Intermittent
THERMALLatent HeatJ/g≥140DSC
Softening interval37/43DSC
Thermal conductivityW/m.K1ASTM D5470

Note: It’s recommended to have around 5% compression by screwing or clamping force at its softening temperature gap.

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