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GTP-PCM180-LH PCM Heat Absorbing Materials

Description

GTP-PCM180-LH is a non-silicon phase change material with an organic cross-linked network structure, offering high latent heat (≥180 J/g), excellent stability, insulation, and thermal conductivity. It absorbs heat at a design temperature of 37 or 43°C, providing efficient thermal management for temperature-sensitive and high-power devices by delaying temperature rise.

The material has high mechanical strength and flexibility after heat absorption, ensuring interface compatibility and effective heat transfer. It can be processed into sheets of varying thickness or molded into custom shapes for various applications.

Features & Benefits

  • High latent heat≥180J/g
  • Good insulation and high reliability
  • Available for modified PCM transition temperature
  • Softening surface and lower thermal impedance after absorbing heat
  • Customizable for molding structures according to specific drawings

Typical Applications

Temperature control for battery cell modules
Wearable devices
Medical devices
Recyclable heat and utilization
Cold-chain applications

Remarks:

  1. Shelf-life can be 12months since date of manufacturing
  2. Storage condition: 0-35°C & RH≤65%
  3. Supply form: in sheets or molding parts etc.
More Details
ItemUnitGTP-PCM180-LHStandards
PHYSICALColorGrayVisual
HardnessShore A50 Shore 00(60°C)
70 Shore A(40°C)
75 Shore A(20°C)
ASTM D374
AdhesiveOptional
(Pre-laminated with
CU/Graphite foil)
Densityg/cc0.9ASTM D792
Elongation strengthMpa2.2ASTM D412
Elongation at break%65ASTM D412
Dielectric StrengthKV/mm>10.0ASTM D149
Breakdown voltageKV/mm>11.0ASTM D149
Volume ResistivityΩ-cm1.0x 10¹⁵ASTM D257
TGA Weight Losswt%<0.5150°
Cx24hrs
Operating Temp.°C-40~100(Long-term)
-50~125 (Intermittent)
THERMALLatent HeatJ/g≥180DSC
Softening interval°C37/43DSC
Thermal conductivityW/m.K0.5ASTM D5470

 

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