GTP-PG020 REV01 Thermal Conductive Potting Gel
GTP-PG020 Rev01 is a 2-component epoxy-based encapsulant material which can be cured in room temperature or heat-accelerated conditions. It exhibits high thermal conductivity, short tack-free time, and superior environmental resistance. After the curing process, it can be very hard and thus exhibit a much lower CTE to better accommodate various designs and avoid failures of electronic components.
Features & Benefits
- Optimum thermal conductivity: 2.0W/m.K
- Automatic & quick air bubble emission
- Low viscosity for ease mixing and potting job
- No corrosion or oxidation to any contact surfaces
- Primer less and excellent bonding strength
Typical Applications
- Motors, capacitors, transmitter
- Transformer, high power battery packs, UPS
Remarks:
- Shelf-life can be 6 months in original container
- Available packaging: 11kgs/set, 22kgs/set etc.
Operation Instructions
Surface Treatment:
- Use a sandblaster or grinding wheel to clean the surface to be bonded, removing rust and the oxide layer.
- Clean the surface thoroughly with a residue-free solvent or cleaner.
- After cleaning, apply the adhesive as soon as possible to prevent the cleaned surface from rusting, oxidizing, or getting contaminated again.
- Avoid touching the cleaned surface with bare hands. If touched, clean it again with a cleaner.
- Ensure no liquids enter the bonding surface when applying the adhesive.
Mixing:
When mixing, take care not to introduce too much air. It is recommended to use an automatic mixing device, as it not only mixes the resin and hardener in the correct proportions but also prevents air from being introduced. If an automatic device is not used, always ensure the containers of Component A (resin) and Component B (hardener) are sealed to prevent moisture absorption. Bulk materials must be thoroughly mixed before use, as insufficient mixing can lead to unstable resin performance or incomplete curing.
Curing:
This product cures at room temperature according to the “Curing Performance” data above. If the temperature is below 25°C, extend the curing time appropriately. Heat curing can improve coating performance. Holding at 80°C for 40 minutes will yield satisfactory curing results.
Post-processing:
After curing for 24 hours, traditional machining methods such as turning, grinding, drilling, and tapping can be used to achieve
- Data Sheet
| Item | Unit | GTP-PG020A | GTP-PG020B |
| Color (Original) | – | Black | Light Yellow |
| Density (Original) | g/cc | 2.6 | 1.0 |
| Viscosity (Original) | Cps | 50000±500 | 120±20 |
| Mixing ratio (by weight) | – | — | 10:1 |
| Color (Mixed) | – | — | Black |
| Density (Mixed) | g/cc | — | 2.3±0.02 |
| Operation time | Min | — | 60 |
| Curing time @ RT | Hrs | — | 24 |
| Curing time @ 80°C | Min | — | 40 |
| Hardness (Post-cured) | Shore D | — | 80±5 |
| Thermal Conductivity | W/m.K | — | 2.0 |
| Dielectric strength | KV/mm | — | ≥20 |
| Volume resistance | Ω-cm | — | ≥1.0×10¹³ |
| Elongation | % | — | >3 |
| Tensile strength | Mpa | — | >50 |
| CTE | m/m.k | — | ≤1.0×10-4 |
| Service temperature | °C | — | -40 to 125 |
| Flame rating | UL94 | — | V-1 |
