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GTP010 Thermal Pad

Description

GTP010 is a highly conformable / thermally conductive type silicone gap filler pad, designed with fiberglass reinforced carrier to improve its mechanical endurance,like abrasion, punch etc. Owning to its ultra-soft polymer technology, it can be well bridging the irregular gap voids under lower required compression forces and can be very high cost competitive and physically shock absorption and noise damping to fit in the various application & design purpose.

Features & Benefits

  • Superior thermal conductivity: 1.0W/m.
  • High insulation compatibility
  • Low volatile emission (D3-D10: <100ppm)
  • Good resilient elastomeric functions
  • High deflections and flexibility to irregular gaps filling
  • Excellent vibration absorption capabilities
  • Resistant to abrasion and punch applications well
  • Cost-saving solutions
  • Wide range of hardness options

Typical Applications

  • EV battery packs
  • High power density LED module
  • Power supplies, UPS
  • Telecommunication equipment, 5G module units
  • Military gadgets, radar, power inverters
  • Signal transmitter, PC peripherals

Remarks:

  1. Shelf-life can be 24 months since date of manufacture
  2. Supply form: Sheet, die-cut/kiss-cut parts or prelaminated with adhesive, DC1 (1-side adhesive) etc.
  3. Standard sheet size: 300x400mm

 

GTP010 Thermal Pad specification

More Details
ItemUnitGTP010Standards
PhysicalColorCool GreyVisual
Thicknessmm0.2–20ASTM D374
HardnessShore 0010–70ASTM D2240
Densityg/cc2.1ASTM D792
Elongation%65ASTM D412
Tensile Strengthpsi<42ASTM D412
Dielectric StrengthkV/mm>10ASTM D149
Breakdown VoltagekV/mm>13ASTM D149
Volume ResistivityΩ·cm$1.0 \times 10^{13}$ASTM D257
TGA Weight Losswt%<0.5150°C × 24 hrs
Operating Temp.°C−60 ~ 200
FlammabilityV0UL94
ThermalThermal ConductivityW/m·K1.0ASTM D5470
Thermal Impedance @ 10 psi / 1 mm°C·in²/W1.215ASTM D5470
Thermal Impedance @ 20 psi / 1 mm°C·in²/W1.108ASTM D5470

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