GTP012USVO Ultra-soft Thermal Pad

GTP012USVO is a highly conformable / thermally conductive type silicone gap filler pad, designed with fiberglass reinforced carrier to improve its mechanical endurance, like abrasion, punch etc. Owning to its putty-state ultra-soft polymer structures, it can be well bridging the irregular gap voids under lower required compression forces and can exhibit outstanding performance without sacrificing thermal performance by laminating with additional adhesives or other surface
treatment.

Features & Benefits

• Superior thermal conductivity: 1.2W/m.K
• High insulation compatibility
• Super soft material and good wettability for matting surfaces
• High deflections and flexibility to irregular gaps filling
• Excellent vibration absorption capabilities
• Resistant to abrasion and punch applications well
• Cost-saving solutions

Typical Applications

• Laser equipment
• High power density LED module
• Power supplies, UPS
• Telecommunication equipment, 5G module units
• Military gadgets, radar, power inverters
• Signal transmitter, PC peripherals

Remarks:

1. Shelf-life can be 24 months since date of manufacture
2. Supply form: Sheet, die-cut/kiss-cut parts or prelaminated with adhesive, DC1 (1-side adhesive) etc.
3. Standard sheet size: 300x400mm