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GTP015NS REV01 Non-Silicone Thermal Pad

Description

GTP015 is a highly conformable / thermally conductive type silicone gap filler pad, designed with fiberglass reinforced carrier to improve its mechanical endurance, like abrasion, punch etc. Owning to its putty-state ultra-soft polymer structures, it can be well bridging the irregular gap voids under lower required compression forces and can exhibit outstanding performance without sacrificing thermal performance by laminating with additional adhesives or other surface treatment.

Features & Benefits

  • Superior thermal conductivity: 1.5W/m.K
  • High insulation compatibility
  • Super soft material and good wettability for matting
    surfaces
  • High deflections and flexibility to irregular gaps filling
  • Excellent vibration absorption capabilities
  • Resistant to abrasion and punch applications well
  • Cost-saving solutions

Typical Applications

  • Laser equipment
  • High power density LED module
  • Power supplies, UPS
  • Telecommunication equipment, 5G module units
  • Military gadgets, radar, power inverters
  • Signal transmitter, PC peripherals

Remarks:

  1. . Shelf-life can be 24 months since date of manufacture
  2. Supply form: Sheet, die-cut/kiss-cut parts or prelaminated with adhesive, DC1 (1-side adhesive) etc.
  3.  Standard sheet size: 300x400mm

More Details
ItemUnitGTP015NS REV01Standards
PHYSICALLight GreyVisual
mm0.5–8.0ASTM D374
Shore 0020–50ASTM D2240
g/cc2.0ASTM D792
%55ASTM D412
Psi<32ASTM D412
kV/mm>10ASTM D149
kV/mm>12ASTM D149
Ω-cm1.0×10⁷ASTM D257
wt%<0.3150°C×24hrs
°C-60 ~ 125
PassSGS
THERMALW/m·K1.5ASTM D5470
°C·in²/W0.852ASTM D5470
°C·in²/W0.788ASTM D5470

 

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