GTP015NS REV01 Non-Silicone Thermal Pad
Description
GTP015 is a highly conformable / thermally conductive type silicone gap filler pad, designed with fiberglass reinforced carrier to improve its mechanical endurance, like abrasion, punch etc. Owning to its putty-state ultra-soft polymer structures, it can be well bridging the irregular gap voids under lower required compression forces and can exhibit outstanding performance without sacrificing thermal performance by laminating with additional adhesives or other surface treatment.
Features & Benefits
- Superior thermal conductivity: 1.5W/m.K
- High insulation compatibility
- Super soft material and good wettability for matting
surfaces - High deflections and flexibility to irregular gaps filling
- Excellent vibration absorption capabilities
- Resistant to abrasion and punch applications well
- Cost-saving solutions
Typical Applications
- Laser equipment
- High power density LED module
- Power supplies, UPS
- Telecommunication equipment, 5G module units
- Military gadgets, radar, power inverters
- Signal transmitter, PC peripherals
Remarks:
- . Shelf-life can be 24 months since date of manufacture
- Supply form: Sheet, die-cut/kiss-cut parts or prelaminated with adhesive, DC1 (1-side adhesive) etc.
- Standard sheet size: 300x400mm

More Details
- Data Sheet
| Item | Unit | GTP015NS REV01 | Standards |
| PHYSICAL | – | Light Grey | Visual |
| mm | 0.5–8.0 | ASTM D374 | |
| Shore 00 | 20–50 | ASTM D2240 | |
| g/cc | 2.0 | ASTM D792 | |
| % | 55 | ASTM D412 | |
| Psi | <32 | ASTM D412 | |
| kV/mm | >10 | ASTM D149 | |
| kV/mm | >12 | ASTM D149 | |
| Ω-cm | 1.0×10⁷ | ASTM D257 | |
| wt% | <0.3 | 150°C×24hrs | |
| °C | -60 ~ 125 | – | |
| – | Pass | SGS | |
| THERMAL | W/m·K | 1.5 | ASTM D5470 |
| °C·in²/W | 0.852 | ASTM D5470 | |
| °C·in²/W | 0.788 | ASTM D5470 |



