GTP025 Thermal Pad

GTP025 is a highly conformable, resilient and thermally conductive type silicone gap filler pad, optional with or without fiberglass reinforced carrier to improve its ease of operation in mass productions. Owning to its resilient ultra-soft polymer structures, it can be well bridging the irregular gap voids under lower required compression forces and can exhibit outstanding performance without any additional adhesives or other surface treatment. It is offered with inherent natural tack on both sides of the material.

Features & Benefits

• Superior thermal conductivity: 2.5W/m.K
• Low thermal resistance at very low pressures
• Super soft material and good wettability for matting surfaces
• High deflections and flexibility to irregular gaps filling
• Excellent vibration absorption capabilities
• Resistant to abrasion and punch applications well
• Cost-saving solutions

Typical Applications

• Laser equipment
• High power density LED module
• Mass storage devices
• Graphics card/processor/ASIC
• Automotive engine/transmission controls
• Signal transmitter, PC peripherals

Remarks:

1. Shelf-life can be 24 months since date of manufacture
2. Supply form: Sheet, die-cut/kiss-cut parts or prelaminated with adhesive, DC1 (1-side adhesive) etc.
3. Standard sheet size: 300x400mm or 350x350mm