GTP030 REV02 Thermal Pad

GTP030 Rev02 is a Boron Nitride filled thermal gap filler pad, designed for applications where require low density, no signal loss when transmitting the radios/signals which is sensitive to the materials such as alumina fillers etc. Owning to its putty-state ultra-soft polymer structures, it can be well bridging the irregular gap voids under lower required compression forces and can exhibit outstanding performance without sacrificing thermal performance by laminating with additional adhesives or other surface treatment.

Features & Benefits

• Superior thermal conductivity: 3.0W/m.K
• Low Dielectric Constant
• High insulation compatibility
• Super soft material and good wettability for matting surfaces
• High deflections and flexibility to irregular gaps filling
• Excellent vibration absorption capabilities
• Cost-saving solutions

Typical Applications

• Laser equipment
• High power density LED module
• Power supplies, UPS
• Telecommunication equipment, 5G module units
• Military gadgets, radar, power inverters
• Signal transmitter, PC peripherals

Remarks:

1. Shelf-life can be 24 months since date of manufacture
2. Supply form: Sheet, die-cut/kiss-cut parts or prelaminated with adhesive, DC1 (1-side adhesive) etc.
3. Standard sheet size: 300x400mm