GTP050-NS REV01 Non-Silicone Thermal Pad

GTP050-NS REV01 is a highly conformable / thermally conductive type EPDM-resin formulated gap filler pad, which exhibits outstanding & reliable performance and is designed to mate with silicone-sensitive and high compression applications. With its intrinsic property of softening after heating up
with power chips, it can be well bridging the irregular gap voids under lower required compression forces and can  be satisfied without sacrificing thermal performance by laminating with additional adhesives or other surface treatment.

Features & Benefits

• Superior thermal conductivity: 5.0W/m.KElectrically conductive, zero oil bleeding
• Super soft material and good wettability for matting surfaces
• High deflections and flexibility to irregular gaps filling
• Excellent vibration absorption capabilities
• Conformable with very low compression forces
• Cost-saving solutions

Typical Applications

• Laser equipment
• High power density LED module
• Power supplies, UPS
• Telecommunication equipment, 5G module units
• Military gadgets, radar, power inverters
• Signal transmitter, PC peripherals
• Medical equipment, camera, surveillance equipment

Remarks:

1. Shelf-life can be 12 months since date of manufacture
2. Supply form: Sheet, die-cut/kiss-cut parts etc.
3. Standard sheet size: 300x400mm