GTP050USVO REV01 Ultra-soft Thermal Pad

GTP050USVO REV01 is a highly conformable & low deflection force version thermally conductive silicone gap filler pad, designed with optional fiberglass reinforced carrier to improve its mechanical endurance, like abrasion, punch etc. Owning to its putty-state ultra-soft polymer structures, it can be well bridging the irregular gap voids under lower required compression forces and can exhibit outstanding performance without sacrificing thermal performance by laminating with additional adhesives or other surface  treatment.

Features & Benefits

• Superior thermal conductivity: 5.0W/m.K
• Ultra-low volatile outgassing
• Excellent resilience and good wettability for mattingsurfaces
• High deflections and good reworkability
• Excellent vibration absorption capabilities
• Resistant to abrasion and punch applications well
• Cost-saving solutions

Typical Applications

• Laser equipment, surveillance cameras
• High power density LED module
• Power supplies, UPS, medical devices
• Telecommunication equipment, 5G module units
• Military gadgets, radar, power inverters
• Power control units, ECU(Engine Control Units)

Remarks:

1. Shelf-life can be 24 months since date of manufacture
2. Supply form: Sheet, roll, die-cut/kiss-cut parts or prelaminated with adhesive, DC1 (1-side adhesive) etc.
3. Standard sheet size: 300x400mm