GTP060-NS Non-Silicone Thermal Pad

GTP060-NS is a highly conformable / thermally conductive type EPDM-resin formulated gap filler pad, which exhibits outstanding & reliable performance and is designed to mate with silicone-sensitive applications. With its intrinsic property of softening after heating up  with power chips, it can be well bridging the irregular gap voids under lower required compression forces and can be satisfied without sacrificing thermal performance by laminating with additional adhesives or other surface treatment.

Features & Benefits

• Superior thermal conductivity: 6.0W/m.K
• Electrically insulated, zero oil bleeding
• High compatibility to irregular surface and efficient to absorb heat to get softening
• High deflections and flexibility to irregular gaps filling
• Excellent vibration absorption capabilities
• Conformable with very low compression forces
• Cost-saving solutions

Typical Applications

• Laser equipment
• High power density LED module
• Power supplies, UPS
• Telecommunication equipment, 5G module units
• Military gadgets, radar, power inverters
• Signal transmitter, PC peripherals
• Medical equipment, camera, surveillance equipment

Remarks:

1. Shelf-life can be 12 months since date of manufacture
2. Supply form: Sheet, die-cut/kiss-cut parts etc.
3. Standard sheet size: 300x400mm