GTP090 Thermal Pad

GTP090 is an ultra-soft and compliant gap filling material with a thermal conductivity of 9.0W/m.k, which offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. This material is ideal for applications requiring low stress on components and boards during assembly. Its conformable nature gives an excellent wet-out characteristic, even to surfaces with high roughness. Also, its natural inherent tack on both sides can eliminate the need for thermally impeding adhesive layers.

Features & Benefits

• Superior thermal conductivity: 9.0W/m.K
• Electrically isolating
• Super soft material and good wettability for matting surfaces
• Good deflections and flexibility to irregular gaps filling
• Excellent vibration absorption capabilities
• Conformable with very low compression forces
• Excellent thermal performance at low pressures

Typical Applications

• Laser equipment
• High power density LED module
• Power supplies, UPS
• Telecommunication equipment, 5G module units
• Military gadgets, radar, power inverters
• Signal transmitter, ASICs and DSPs

Remarks:

1. Shelf-life can be 24 months since date of manufacture
2. Supply form: Sheet, die-cut/kiss-cut parts or prelaminated with adhesive, DC1 (1-side adhesive) etc.
3. Standard sheet size: 300x400mm