What is Thermal Epoxy Adhesive
Thermal epoxy adhesive is a specialized type of epoxy adhesive that combines both adhesive and thermal conductivity properties. Compared to ordinary epoxy adhesive, GALLOP INNOTEK thermal epoxy adhesive has more advantages.
Ordinary epoxy adhesive has almost no heat dissipation function, whereas thermal epoxy adhesive can transfer heat out of the equipment due to its high thermal conductivity fillers. The thermal epoxy adhesive can withstand high temperatures and is less likely to soften than ordinary epoxy adhesives.
Features of Thermal Epoxy Adhesive
Thermal Conductivity: High-efficiency heat dissipation is a core function of thermal epoxy adhesive. In electrical devices, components such as chips, power modules, and LEDs generate a significant amount of heat when in operation. If the heat cannot be exported in a timely manner, it may cause overheating issues, leading to performance degradation or damage. GALLOP INNOTEK thermal epoxy adhesive forms a high thermal conductivity channel at the adhesion interface, transferring heat to the heat sink or metal cover to help your equipment maintain a normal operating temperature.
Adhesion Strength: GALLOP INNOTEK thermal epoxy adhesive can not only conduct heat, but also offers high adhesive strength. This performance ensures that the components are securely fastened, even in high-temperature environments or under high shock conditions, thereby avoiding issues with loosening or coming loose. It is suitable for many types of substrates, including metals, ceramics, plastics, and composite materials.
Insulation: Thermal epoxy adhesive is also widely used in electric components, which require insulation to prevent the risk of short circuits or electrical leakage. GALLOP INNOTEK thermal epoxy adhesive offers good insulation function, transferring heat while maintaining a safe condition, providing dual protection for the equipment.
Temperature Resistance and Environmental Performance: GALLOP INNOTEK thermal epoxy adhesive can operate normally in high temperatures and is suitable for applications with high heat loads. The thermal epoxy adhesive will form a dense, protective layer after curing, preventing moisture intrusion and oxidation, and preventing short circuits. It can also resist some medical corrosion and extend the service life of the devices. If you need to transport these devices, GALLOP INNOTEK thermal epoxy adhesive will offer additional cushioning protection, decreasing the risk of structural damage.
Types of Thermal Epoxy Adhesive
According to its different formulations and usage, GALLOP INNOTEK thermal epoxy adhesive can be classified into various types. Understanding these differences is helpful in choosing the most suitable thermal epoxy adhesive. Below are some common types of thermal epoxy adhesive:
Single-Component Thermal Epoxy Adhesive
The formulation of GALLOP INNOTEK single-component thermal epoxy adhesive has been achieved in the production process, so you do not need to mix it yourself. But it requires heat curing before use. Single-component thermal epoxy adhesive offers a simple and convenient process to use, and avoids incomplete curing issues caused by uneven mixing. It is suitable for large-scale automated production, and can keep stable quality in each batch.
Two-Component Thermal Epoxy Adhesive
GALLOP INNOTEK two-component thermal epoxy adhesive is composed of resin and curing agent; it needs to be mixed before use. However, the curing method of two-component thermal epoxy adhesive is more flexible, allowing you to choose between room-temperature curing and heat curing to adapt to different production requirements. During the mixing process, it is necessary to control the ratio precisely, as this can affect the performance.
High Thermal Conductivity Epoxy Adhesive
High-content or high-performance conductive fillers are added to high-thermal-conductivity epoxy adhesive, making it have higher thermal conductivity than standard products. GALLOP INNOTEK high thermal conductivity epoxy adhesive is designed for applications with high thermal load. It offers an excellent heat dissipation function to transfer heat efficiently, thereby extending the service life of the equipment. However, the high content of thermal fillers may increase the viscosity of the adhesive, so it is advisable to use a suitable method for application.
Low-Viscosity Thermal Epoxy Adhesive
GALLOP INNOTEK low-viscosity thermal epoxy adhesive possesses good flowability, making it suitable to be use in automatic dispensing equipment and easy to operate. For small or precise components, this type of thermal epoxy adhesive can fill the tiny gaps, ensuring a uniform thermal interface. If your project requires high viscosity or high thermal conductivity, it may not be a suitable option.
Application
Electronics
Chips and power components in the electronics industry have strict requirements for heat management. GALLOP INNOTEK thermal epoxy adhesive can help the chip fix to the substrate, and transfer the heat produced in the work to the heat sinks. It can decrease the operation temperature and reduce rework rates or product failures caused by overheating, ensuring a stable electronic signal transmission condition.
Electric Vehicle
The core components of new energy vehicles require higher thermal dissipation, and thermal epoxy adhesive can meet the requirement. It is typically used in battery management systems (BMS) of vehicles to connect battery cells and transfer the heat produced during the charging or discharging process. If your project is connected to the automotive industry, GALLOP INNOTEK thermal epoxy adhesive will enhance overall safety and battery life.
Industry and Energy
GALLOP INNOTEK thermal epoxy adhesive is also used in the industrial equipment and energy sectors, such as electric motors, transformers, solar inverters, and control modules. This equipment is designed to operate in harsh conditions, so it requires a thermal epoxy adhesive that exhibits excellent environmental performance. GALLOP INNOTEK thermal epoxy adhesive can meet the requirements and adapt to various climates.
