What is a Thermal Glue for Heat Sink
GALLOP INNOTEK Thermal Glue for Heat Sinks (thermal adhesive) is a specially designed adhesive for use between electronic components and heat sinks. Its greatest strength lies in its ability to combine excellent bonding strength with thermal conductivity:
Like glue, it securely fastens the heat sink to the surface of the chip or power device, and, like thermally conductive material, it creates an efficient heat dissipation path between the two.
Therefore, it is particularly suitable for applications that require both secure attachment and efficient heat dissipation.
Why Choose GALLOP INNOTEK Thermal Glue for Heat Sinks?
Secure Bonding: GALLOP INNOTEK Thermal Glue offers both structural bonding and thermal conductivity, ensuring a secure fit between the heat sink and the heating element.
Excellent Thermal Conductivity: GALLOP INNOTEK GTP-AS030-D boasts a thermal conductivity of up to 3.0 W/m·K, significantly improving heat dissipation efficiency.
Electrical Insulation: While conducting heat, it maintains high dielectric strength, preventing the risk of short circuits.
Easy to Use: GALLOP INNOTEK Thermal Glue for Heat Sinks features a two-component, 1:1 mixing design and a 20–30 minute working time, providing you with flexibility and efficiency.
Reliable and Durable: GALLOP INNOTEK Thermal Glue for Heat Sinks meets UL94 V-0 flame retardancy standards and operates stably in environments ranging from -40°C to +85°C.
GALLOP INNOTEK’s high-temperature silicone thermal glue provides strong adhesion and reliable heat transfer for LEDs, ICs, and compact heat sinks.
Our CPU/GPU thermal adhesive offers excellent thermal conductivity and firm bonding, ideal for processors and graphics chips without mechanical fasteners.
GALLOP INNOTEK’s insulating thermal glue ensures effective heat dissipation while preventing electrical conduction in sensitive electronic components.
Our two-part epoxy thermal adhesive delivers strong, permanent bonding with high thermal conductivity for power modules and high-heat devices.
GALLOP INNOTEK’s fast-curing thermal glue dries quickly and maintains stable thermal performance for rapid device assembly.
Our LED thermal adhesive enhances heat dissipation in LED modules, improving efficiency and extending lifespan in lighting applications.
GALLOP INNOTEK’s thermal adhesive paste supports high-power semiconductors with superior heat transfer and long-term durability.
Our ceramic-filled thermal adhesive offers excellent conductivity and electrical insulation, suitable for high-demand industrial electronics.
How to Apply GALLOP INNOTEK Thermal Glue for Heat Sinks?
Surface Preparation
Prepare devices for heat dissipation. Before using the GALLOP INNOTEK Thermal Glue for Heat Sinks, take care of the surface of your devices. In the vicinity of the bonding, any oxide layer, rust, and impurities should be removed by means of grinding, sandblasting, or a similar method, and the surface should be thoroughly cleaned with a solvent, such as isopropanol, free from residue. This guarantees a smooth, dry, and contamination-free surface, ensuring your new adhesion lasts.
Mixing and Application
When prepared, mix GALLOP INNOTEK Thermal Glue for Heat Sinks materials A and B in a 1:1 volume ratio until they are homogeneously mixed. A clean dispensing gun should be used to ensure consistent results, accurate mixing, and uniform application throughout the bonding area. Evenly apply the GALLOP INNOTEK adhesive to eliminate any voids and aid in heat transfer.
Curing
After your application, the GALLOP INNOTEK material works for approximately 20 – 30 minutes at room temperature, after application, all the way to allowing you up to 20/30 minutes for positioning and resetting to the perfect shape. For the maximum performance, cure the assembly for 20–30 minutes at 80–100°C, resulting in high die shear strength and high thermal conductivity.
Key Parameters (GTP-AS030-D Series)
Color: Black/White (Black after two-component mixing)
Thermal Conductivity: 3.0 W/m·K
Adhesion Strength: Shear Strength 9.5 MPa, Tensile Strength >15 MPa
Dielectric Strength: ≥14 kV/mm
Potency: 20–30 minutes (room temperature)
Cure Time: 30 minutes at 80°C or 20 minutes at 100°C
Hardness: Shore D 70
Operating Temperature: -40°C to +85°C
Flammability Rating: UL94 V-0
User Value of Thermal Adhesive
For engineers, GALLOP INNOTEK thermal adhesive employs less or no mechanical fixing, simplifying the assembly process. This not only shortens the assembly cycle but also improves production efficiency.
For equipment manufacturers, thermal adhesive from GALLOP INNOTEK provides an assured bonding and thermal path that can mitigate the chance of your cooling system failure and increase the resiliency and reliability of a product from the system level.
On the side of end users, GALLOP INNOTEK thermal adhesive provides peace of mind, ensuring devices remain cold, stable, and quiet for an extended period of operation. This allows your end users to enjoy a smoother and more consistent user experience.
Conclusion
Thermal glue for heat sinks is more than just an adhesive; it is a stable and reliable thermal solution. Whether it’s power modules, inverters, LED lighting, or automotive electronics and new energy equipment, GALLOP INNOTEK provides you with enhanced safety and a longer service life. If you have high-quality requirements for equipment, please refer to the GALLOP INNOTEK Thermal Glue for Heat Sinks series user guide for more adhesive information.
