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Graphite Thermal Pad

Graphite Thermal Pad

Unlike other thermal pads you may be familiar with, GALLOP INNOTEK graphite thermal pads are manufactured through a combination of calendering, lamination, and specialized processes, making them an ideal choice for thermal pads.

What is a Graphite Thermal Pad

GALLOP INNOTEK graphite thermal pads are a flexible, thermally conductive material based on artificial, highly conductive graphite. Similar to graphene, GALLOP INNOTEK graphite thermal pads typically consist of graphene, forming a three-dimensional structure composed of multiple layers. Within this three-dimensional structure, the graphite layered crystals exhibit distinct thermal conductivity properties:

In the X-Y plane, heat dissipates rapidly, with a thermal conductivity of 300-1500 W/m·K. For example, the GALLOP INNOTEK GTS-NA200 model graphite thermal pads achieve a planar thermal conductivity of 700 W/m·K.

In the Z-direction, while the thermal conductivity is relatively low (5-15 W/m·K), it still achieves efficient heat transfer and uniform heat dissipation. In the vertical direction, the GALLOP INNOTEK GTS-NA200 graphite thermal pads have a thermal conductivity of approximately 6.5 W/m·K.

This unique structure makes the graphite thermal pad an ideal material for “planar diffusion + vertical conduction” heat dissipation, especially suitable for device applications that require high power density and compact space.

Graphite Thermal Pad

Core Advantages of Graphite Thermal Pad 

High Thermal Conductivity

The high-speed planar heat dissipation of the GALLOP INNOTEK graphite thermal pad quickly and effectively chills those hot spots. It creates the best heat transfer route, which covers the heat source directly and allows heat to pass out through the finishing form.

Lightweight and Flexible

The thickness of the Factory Replacements: The GALLOP INNOTEK GTS-NA200 graphite construction thermal pads is only 0.025-0.5mm. Its ultra-thin and flexible profile enables vertical cutting and bending, while its ability to accommodate both complex and tight thermal clearances provides versatile designs for your many devices.

Long-term Reliability

Unlike thermal paste, the GALLOP INNOTEK graphite thermal pad will not dry out or melt. Ideal for devices not working under the toughest conditions. It doesn’t bleed easily, like the silicone thermal pads in your office laptop. It requires no maintenance, and it minimizes machine maintenance.

Easy Installation

GALLOP INNOTEK graphite thermal pads can be placed between chips and heat sinks without any extra steps or cleaning up a mess of thermal paste. Graphite is a 3D solid, so bleed-out is significantly lower than that of paper gaskets, and the installation is clean and easy. It is suitable for automatic production, has high efficiency, and offers a significant installation advantage.

GTS-NA200 graphite thermal sheet
  • Superior thermal conductivity in plane: 700W/m.K
  • Lightweight and ultra-thin
  • Flexible and easy to be cut or trimmed
  • Low thermal resistance
  • EMI Shielding
  • Long-life and high temperature endurable
  • Low repulsion and good conformability with surfaces when lamination
  • Siloxane free for silicone sensitive applications
  • RoHS / UL94 V0 compliant
GTP-NA200 REV01 graphite thermal sheet
  • Superior thermal conductivity in plane: 800W/m.K
  • Lightweight and ultra-thin
  • Flexible and easy to be cut or trimmed
  • Low thermal resistance
  • EMI Shielding
  • Long-life and high temperature endurable
  • Low repulsion and good conformability with surfaces when lamination
  • Siloxane free for silicone sensitive applications
  • RoHS / UL94 V0 compliant
GTS-NA100 graphite thermal sheet
  • Superior thermal conductivity in plane: 480W/m.K
  • Lightweight and ultra-thin
  • Flexible and easy to be cut or trimmed
  • Low thermal resistance
  • EMI Shielding
  • Long-life and high temperature endurable
  • Low repulsion and good conformability with surfaces when lamination
  • Siloxane free for silicone sensitive applications
  • RoHS / UL94 V0 compliant

Diverse OptionsDiverse Options

GALLOP INNOTEK graphite thermal pads can be coated with PET film, metalized, or insulating coatings to meet the requirements of heat dissipation and safety in various use environments, in addition to thermal conductivity. Applications of Graphite Thermal Pads

Smartphones

If you have a high-performance flagship phone, then GALLOP INNOTEK graphite heatsinks are ideal for your phone’s CPU/GPU, which generates significant heat during prolonged, high-load computing. GALLOP INNOTEK graphite heatsinks quickly dissipate the heat generated by the chip to the backplate, preventing local overheating and ensuring optimal performance and a user-friendly experience.

5G Communications Equipment

In base station antenna arrays, RF components and processors generate significant heat. GALLOP INNOTEK graphite heat sinks evenly distribute heat to the metal casing, ensuring continuous heat dissipation from the array and stable base station operation over the long term.

LED High-Power Lighting

High-brightness LED chips are prone to light degradation when insufficient heat is dissipated. GALLOP INNOTEK graphite thermal pads enable rapid heat transfer and dissipation, ensuring adequate heat dissipation for your lamps, maintaining stable performance, and extending lamp life.

New Energy Vehicle Batteries

GALLOP INNOTEK graphite gaskets can be used between battery modules to evenly distribute heat generated by individual cells, preventing thermal runaway and improving your battery life and safety.

Technical Parameters of GALLOP INNOTEK Graphite Thermal PadsTechnical Parameters of GALLOP INNOTEK Graphite Thermal Pads

With low mass and high heat transfer capabilities, GALLOP INNOTEK graphite pads are high-performance, high-heat-spreading thermal interface materials available in ultra-thin and lightweight configurations, making them an ideal solution for ultra-low-profile heat spreading in lightweight applications.

Natural Graphite GTS-NA100

GALLOP INNOTEK Natural Graphite GTS-NA100 boasts extremely high in-plane thermal conductivity (up to 480 W/m·K) while maintaining a thin, flexible, and excellent mechanical strength. It rapidly diffuses and conducts heat in ultra-thin applications, effectively reducing device thermal resistance. With a wide operating temperature range (-40°C to 400°C), an excellent flame retardancy rating (UL94 V0), and compliance with environmental standards, this material is not only suitable for high-power density heat dissipation scenarios but also meets the long-term stability requirements of applications in consumer electronics, automotive electronics, and communications equipment.

Item Parameter Range

Color Unit: Black

Thermal Conductivity (X-Y Direction): 480 W/m·K

Thermal Conductivity (Z Direction): 5.0 W/m·K

Thickness: 0.025 -0.5mm

Density: 0.085-1.6 g/cm³

Tensile Strength: >3.0 Mpa

Operating Temperature Range: -40°C to 400°C

Four-Layer Structure

  1. PET tape
  2. GTS-NA graphite
  3. Adhesive tape
  4. Release liner

Natural Graphite GTS-NA200

GALLOP INNOTEK Natural Graphite GTS-NA200 utilizes a high-purity graphite structure, achieving an increased in-plane thermal conductivity of 700–800 W/m·K and enhanced heat dissipation capabilities. The material operates stably within a -40°C to 400°C range and can withstand temperatures up to 700°C, making it suitable for applications requiring high temperatures and a long lifespan. The GALLOP INNOTEK GTS-NA200’s high tensile strength (>3.5 MPa) and excellent flexibility ensure a balance between mechanical strength and ease of processing. Furthermore, the GALLOP INNOTEK GTS-NA200 thermal pad not only offers low thermal resistance and EMI shielding but is also UL94 V0 flame-retardant certified and silane-free, making it suitable for silicon-sensitive environments. The GTS-NA200 is particularly well-suited for applications in display modules, lighting, automotive electronics, and telecommunications power supply equipment.

Item Parameter Range

Color Unit: Dark Black

Thermal Conductivity (X-Y Direction): 700 W/m·K

Thermal Conductivity (Z Direction): 6.5 W/m·K

Thickness: 0.025 -0.5mm

Density: 0.085-1.6 g/cm³

Tensile Strength: >3.5 Mpa

Operating Temperature Range: -40°C to 400°C

Compressible Natural Graphite GTP-NA200 REV01

The GALLOP INNOTEK Natural Graphite GTS-NA200 REV01 utilizes a high-purity graphite structure, boasting an even higher in-plane thermal conductivity of 800 W/m·K. Even in its ultra-thin form, the GALLOP INNOTEK GTS-NA200 REV01 thermal pad rapidly dissipates heat, significantly reducing localized temperature rise. Its vertical thermal conductivity of 7 W/m·K and thermal diffusivity of 10–12 cm²/s ensure uniform and efficient heat dissipation in compact spaces. Even if your device is large and high-power, you don’t have to worry about thermal conductivity issues. The material itself possesses excellent tensile strength (>3.5 MPa) and high electrical conductivity (20,000 S/cm). It also offers long-term stable operation from -40°C to 400°C and transient temperature resistance up to 700°C. With low thermal resistance, EMI shielding, UL94 V0 flame retardancy certification, and a silane-free design, the GALLOP INNOTEK NA200 REV01 demonstrates excellent reliability and adaptability in display modules, automotive electronics, lighting equipment, and telecommunication power supplies.

Color Unit: Silver Gray

Item Parameter Range

Thermal Conductivity (X-Y Direction): 300-500 W/m·K

Thermal Conductivity (Z Direction): 28.0 W/m·K

Thickness: 0.15 -0.5mm

Density: 0.2-0.85 g/cm³

Tensile Strength: >20 Mpa

Operating Temperature Range: -40°C to 400°C

Graphite Sheet Yield Planner

Estimate simple rectangular part yield, sheet quantity and purchase-area allowance.

Planning/reference estimate: Rectangular nesting only; graphite grain/orientation, handling margin, lamination, cut quality and defects require production review.

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Graphite Sheet Yield Planner

Estimate simple rectangular part yield, sheet quantity and purchase-area allowance.

Planning/reference estimate: Rectangular nesting only; graphite grain/orientation, handling margin, lamination, cut quality and defects require production review.

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