What Is Thermal Putty
GALLOP INNOTEK thermal putty is a dispensable thermal interface material and a composite material made of silicone and thermally conductive fillers. It has high thermal conductivity and low thermal resistance. It is used to fill the gap between the heating element and the heat sink, providing efficient heat transfer and helping electronic devices dissipate heat quickly.
Thermal Putty Properties
Low BLT: GALLOP INNOTEK thermally putty consists of very fine particles, which can ensure a BLT as low as 10um, achieving outstanding heat transfer.
Good wettability: GALLOP INNOTEK thermally putty is a thixotropic material that wets the mating surfaces with its intrinsic inorganic semi-crosslinked compounds, effectively filling the gaps and evacuating the air trapped between them to optimize contact resistance.
High deflections and compressibility: Thermally putty can be compressed very thin by low pressures and can be fitted to any irregular mechanical gaps to effectively fill irregular gaps.
Non-Curing: GALLOP INNOTEK thermally putty is not as fluid as thermally gel. It does not flow vertically and does not require curing during use.
Excellent reliability: Our thermal putty consistently exhibits stable performance over time in aging tests, with no cracks, dry-out, or pump-out issues.
Wide gap filling compatibility: GALLOP INNOTEK thermal putty can be used to fill in large gaps varying from 0.1 – 4.0mm
Efficient: GALLOP INNOTEK thermal putty requires only control of the dispensing amount, eliminating the need for mixing and curing, which enables efficient automated production, especially for high-volume applications.
Inventory-friendly: With thermal putty, you can manage to apply multiple applications with only one or two items in your BOM list, instead of hundreds of die-cut pads in some cases.
Thermal Putty Applications
- Electronics: GALLOP INNOTEK thermal putty is commonly used as a cooling module for smartphones, tablets, and computers. It can provide good heat dissipation for your device in a compact design and keep it lightweight.
- Automotive: You can use GALLOP INNOTEK thermal putty in heat-generating modules such as batteries and power supplies in automobiles. Provides heat dissipation for a long period of time, keeping the car stable and reliable
- LED lighting: High-power LEDs generate a lot of heat when in use, and the GALLOP INNOTEK thermal putty can effectively dissipate the heat, extending their service life.
Tips for Using Thermal Putty
Viscosity of Thermal Putty
GALLOP INNOTEK thermal putty has adhesive properties, but its stickiness only provides good fitting ability and cannot be used for bonding components. So you cannot use it for component fixing.
Shelf Life of Thermal Putty
Remember that GALLOP INNOTEK thermal putty has a shelf life of 12 months from the date of manufacture. For optimal performance, ensure you use the thermal putty within this recommended period.
Clean Surfaces
Impurities can affect the lamination and thermal conductivity of GALLOP INNOTEK thermal putty. You need to clean both surfaces thoroughly before application to ensure they are free of dust, oil, and moisture.
As thin as Possible
The thinner the GALLOP INNOTEK thermal putty, the lower the thermal impedance and the better the thermal conductivity. Apply it as thinly as possible, ensuring it fills the void, and remove the excess.
Like the thermal pad, thermal putty can fill in the component void and provide heat dissipation for the heating element. At the same time, GALLOP INNOTEK thermal putty provides longer lasting durability and is also reusable and easy to rework. Because thermal putty is inherently sticky and does not rely on an adhesive layer to adhere to the element and heatsink.
If your thermal putty has been opened and unused, it needs to be stored airtight and used as soon as possible. For unused thermal putty, you should store it in a cool place at room temperature.
GALLOP INNOTEK’s thermal putty is electrically insulating, and you can safely use it around electronic components.
