What Is Aluminum Nitride Ceramic
GALLOP INNOTEK Aluminium Nitride Ceramics is an industrial ceramic material with Aluminium Nitride as the main component. Thanks to its high heat transfer capability, electrical insulation, and resistance to chemicals, it has become a crucial material for managing temperature and protecting electronics.
GALLOP INNOTEK’s aluminum nitride ceramic ring offers excellent thermal conductivity and strong electrical insulation for high-performance electronic assemblies.
Our aluminum nitride substrates deliver superior heat dissipation and dimensional stability, making them ideal for power modules and semiconductor devices.
GALLOP INNOTEK’s aluminum nitride heat sink provides efficient thermal management with high dielectric strength for compact and sensitive electronic systems.
Our aluminum nitride ceramic crucible withstands extreme temperatures and offers excellent chemical resistance for laboratory melting and high-purity processing.
GALLOP INNOTEK’s aluminum nitride nozzle delivers outstanding thermal shock resistance and precision flow control for industrial and semiconductor applications.
Our aluminum nitride ceramic wafer provides high thermal conductivity and electrical insulation, supporting advanced electronic, optical, and RF device fabrication.
GALLOP INNOTEK’s aluminum nitride insulator ensures reliable dielectric performance and thermal stability in demanding high-voltage and high-power environments.
Our aluminum nitride ceramic spacer offers consistent mechanical strength, thermal reliability, and electrical insulation for precision electronic assemblies.
Aluminum Nitride(ALN) Ceramic Properties
GALLOP INNOTEK’s aluminium nitride ceramic is ideal for heat dissipation because of its efficient heat transfer capability. Using this material in electronic components enables effective thermal management, ensuring equipment operates reliably under demanding conditions.
GALLOP INNOTEK’s aluminium nitride ceramic provides high thermal performance, strong dielectric strength, and reliable electrical insulation. It effectively isolates circuits, making it an ideal choice for your high-voltage and high-power applications.
GALLOP INNOTEK aluminium nitride ceramic will oxidise at high temperatures in an aerobic environment. Severe oxidation will result in blistering and loosening of the surface of the material, or even failure of the whole part by pulverisation. Therefore, it is not suitable for you to use GALLOP INNOTEK aluminium nitride ceramics for a long period of time at high temperatures in an aerobic environment.
GALLOP INNOTEK aluminium nitride ceramic has the high hardness of structural ceramics. It provides excellent support and protection while being lightweight.
GALLOP INNOTEK aluminum nitride ceramic is resistant to corrosion by most molten metals and chemicals. This is because it provides you with stability even in the harshest environments.
GALLOP INNOTEK aluminium nitride ceramic resists high temperatures and features a thermal expansion coefficient that matches silicon. This reduces thermal stress in your chips, ensuring greater stability and reliability even in demanding conditions.
CR-ALN Aluminum Nitride Ceramic Plate
How Is Aluminum Nitride(ALN) Ceramic Made？
Powdering
Mix alumina powder with carbon powder and react at high temperatures in nitrogen to obtain high-purity, fine-particle ALN powder.
Moulding
Choose from casting, dry pressing, isostatic pressing, and injection moulding to mould ALN powder according to your specific needs.
- Cast moulding: Mix ALN powder with binder, plasticiser, and solvent to form a slurry. Make a film of uniform thickness and dry it to get a raw embryo
- Dry pressing and Isostatic pressing: Isostatic pressing (CIP) provides isotropic pressure, resulting in a more uniform density of the blank.
- Injection molding: If you want to manufacture small aluminum nitride ceramics with complex shapes, injection molding can be an efficient way to achieve this.
Sintering
Aluminum nitride ceramics are often prepared by normal-pressure sintering, hot-pressure sintering, and pressureless hot isostatic pressing.
- Atmospheric pressure sintering requires the addition of sintering aids and sintering at high temperatures. You can perform large-scale sintering, but the resulting lower thermal conductivity of GALLOP INNOTEK aluminum nitride ceramic is notable.
- Hot-pressure sintering yields a denser ceramic with high thermal conductivity, but it also incurs higher costs.
- Pressureless hot isostatic pressure sintering under high-pressure inert gas. With this technique, you can obtain high-density and strong GALLOP INNOTEK aluminum nitride ceramics.
Post-processing
Sintered ceramic bodies are very hard and often require precision machining, such as laser cutting and diamond grinding, to ensure they reach your desired dimensions and surface finish. This ensures that it reaches your desired dimensions and achieves the desired surface finish.
Aluminum Nitride Ceramic Applications
Thermal Substrates and Circuit Packaging
If you are designing a high-power electronic module, GALLOP INNOTEK aluminum nitride ceramic would be ideal for you. It has a thermal conductivity similar to that of metallic copper, while maintaining good electrical insulation, which allows for efficient heat conduction without compromising electrical safety. Whether it’s IGBT power modules, MOSFETs, LED lighting, or 5G chips, you can rely on aluminum nitride ceramics to improve the reliability and longevity of your system.
High-frequency and Microwave Device Substrates
GALLOP INNOTEK aluminum nitride ceramics have a moderate dielectric constant and low dielectric loss. It can effectively ensure your signal integrity in high-frequency applications such as radar, satellite communications, and 5G base stations. Therefore, you can use it in microwave communication equipment such as antenna substrates, filters, and power amplifier package housings.
Medical Electronics
Aluminum Nitride Ceramic is safe and environmentally friendly. It is a non-toxic material that can replace the hazardous beryllium oxide. Using it in X-ray machines, CT scanners, and medical laser equipment will ensure your device operates stably and safely for an extended period.
High-temperature Insulating Components
If your work involves high-temperature heating systems such as industrial furnaces or heat treatment units, you need materials that perform under extreme conditions. GALLOP INNOTEK aluminum nitride ceramic withstands temperatures over 1000°C while providing reliable insulation. Used in insulation supports, heat shields, or thermocouple protection tubes, it improves both safety and durability in your equipment.
Aluminum Nitride Ceramic Thermal & Insulation Planner
Estimate ideal through-thickness thermal resistance, temperature rise and minimum electric field across a ceramic plate.
Planning/reference estimate: Excludes contact resistance, metallization, flatness, dielectric-strength derating, creepage, clearance and standards. Supplier and safety review are required.
Aluminium nitride ceramics have a thermal conductivity of 170-230 W/m-K, compared to 20-30 W/m-K for ordinary alumina ceramics. Therefore, if efficient heat dissipation is a priority, aluminium nitride ceramics offer superior performance compared to alumina. At the same time, its coefficient of thermal expansion is much closer to that of silicon chips, which can significantly improve the reliability of electronic devices.
You can choose based on requirements such as thermal conductivity, insulation properties, mechanical strength, dimensional accuracy and processing methods. GALLOP INNOTEK can tailor an aluminium nitride ceramic solution to meet your specific application needs.
Compared to aluminium oxide, aluminium nitride has a more complex production process and is more expensive. However, if your project requires high thermal performance and long-term stability, choosing aluminium nitride ceramics significantly reduces the risk of post-maintenance and failure, and is more cost-effective overall.
