What is Potting Compound
GALLOP INNOTEK potting compound is a resin material used in electronic components. It will form a strong insulation layer on electronic components, protecting electronic devices and improving their performance.
The Benefits of Potting Compound
Insulation: The most important benefit of potting compound is the insulation. Potting compounds can separate the air from electronic components to form an insulation layer, thereby removing the risk of overpressure or arcing. GALLOP INNOTEK potting compound can control and even prevent fire disasters.
Heat Dissipation: During the operation of an electronic component, it produces a significant amount of thermal energy. If the gathered thermal energy cannot be released in a timely manner, then it will cause electronic device short circuits or faults.
GALLOP INNOTEK potting compound also has the function of heat dissipation. It can help electronic devices dissipate heat from inside, thus running with a stable status.
Corrosion Resistance:The moisture in the air may make the electronic device break down, malfunction or corrode. GALLOP INNOTEK potting compound can protect electronic components from the effects of moisture and other chemical materials. Under the protection of the potting compound, the electronic components can perform normal operation when they need to work with water or chemical materials.
Durable: As a part of electronic components, potting compound makes the electronic device more complete and durable. When using an electronic device, minor problems, such as vibration, impact, or falling, may cause damage. GALLOP INNOTEK potting compound can help electronic devices from external harm and extend their service life.
Pollution Isolation: We all know that electronic components are fragile. Even the smallest change can cause significant problems for electronic devices. Such as dust and oil pollution, all can pollute electronic components. All the pollution can be blocked outside the GALLOP INNOTEK potting compound.
- Optimum thermal conductivity: 0.8W/m.K
- Automatic & quick air bubble emission
- Low viscosity for ease mixing and potting job
- No shrinkage when curing and rapid curing time required
- No corrosion or oxidation to any contact surfaces
- Primerless and excellent bonding strength
- Optimum thermal conductivity: 2.0W/m.K
- Automatic & quick air bubble emission
- Low viscosity for ease mixing and potting job
- No shrinkage when curing and rapid curing time required
- No corrosion or oxidation to any contact surfaces
- Primerless and excellent bonding strength
- Optimum thermal conductivity: 1.8W/m.K
- Automatic & quick air bubble emission
- Low viscosity for ease mixing and potting job
- No corrosion or oxidation to any contact surfaces
- Primerless and excellent bonding strength
- Optimum thermal conductivity: 2.0W/m.K
- Automatic & quick air bubble emission
- Low viscosity for ease mixing and potting job
- No corrosion or oxidation to any contact surfaces
- Primerless and excellent bonding strength
Types of Potting Compound
Epoxy Potting Compound
Epoxy potting compound is a hard material with strong mechanical properties. The hardness of epoxy potting compound is almost the same as “rock” after curing. The performance is stable before and after curing.
Epoxy potting compounds can withstand a maximum temperature of about 180℃. However, it cannot adapt to large temperature changes. Hot and cold shocks will cause cracks in epoxy potting compounds.
If your electronic devices are used in small changes in ambient temperature, then GALLOP INNOTEK epoxy potting compound is a suitable type of potting compound for you.
Silicone Potting Compound
Unlike epoxy potting compounds, GALLOP INNOTEK silicone potting compounds exhibit strong flexibility. The biggest advantage of silicone potting compound is it can be repaired after damage.
Silicone potting compounds can also offer long-term protection for sensitive electronic components. It has the best temperature resistance and can withstand temperatures over 250℃.
The silicone potting compound exhibits very strong chemical stability. It can maintain stable performance in any work environment. By the way, silicone potting compound is also resistant to UV rays.
Polyurethane Potting Compound
The urethane potting compound has flexibility and mechanical strength. The adhesion is between the epoxy potting compound and the silicone potting compound.
The heat resistance of the polyurethane potting compound is not good. It can withstand temperatures under 100℃.
Urethane potting compound should be poured in a vacuum situation; otherwise, it will produce numerous bubbles, reducing the efficiency of electronic devices.
GALLOP INNOTEK urethane potting compound is a cost-effective potting compound type if your electronic components are suitable for indoor electrical devices that do not easily generate heat.
How to Use Potting Compounds?
The usage of GALLOP INNOTEK potting compound is very simple. You can choose manual, semi-automatic, or automatic methods to make it work.
Step 1: Clean the Surface
Before using potting compounds, the first step is to clean and dry the surface of the electronic components. Any small impurities and oil stains may cause electronic devices to short-circuit.
Step 2: Measuring by Proportion
Fully stir the different group potting compounds you need to mix together in advance. This can keep the additives evenly distributed in potting compounds.
Then measure the amount of different potting compounds accurately according to the proportion. The right proportion is very important; it can directly affect the protective efficiency of potting compounds.
Step 3 Mix the Potting Compound
Then, mix the measured potting compound from the different groups together, using a special mixer to ensure they are mixed evenly. The principle of mixing evenly is no color difference.
Step 4 Defoaming
Many bubbles will occur when stirring the potting compounds. The remaining bubbles can weaken the curing effect of potting compounds if not removed.
Usually, letting potting compounds defoam under a natural environment is very slow and inefficient. It is necessary to exhaust air to create a vacuum environment, allowing the bubbles to leave more quickly and completely.
Step 5 Potting
Potting the potting compounds in the electronic components. Do not pot too slowly, as this will affect the leveling effect.
Step 6 Curing
The last step is to place the potted electronic components in a room-temperature environment to cure. Keep the curing environment clean to prevent impurities from affecting the curing effect.
Typically, it takes 24 hours for the material to fully cure. The temperature has a great impact on curing speed. The curing speed will be faster in summer and slower in winter. To speed up the curing of GALLOP INNOTEK potting compounds, you can use specialized heating equipment to enhance curing efficiency.
Application of Potting Compound
Electronics Manufacturing
GALLOP INNOTEK potting compound can offer stability to electronic devices. Common applications include Integrated circuits, capacitors, and transformers.
Automobile Industry
GALLOP INNOTEK potting compounds also play a crucial role in the automotive industry. On-board charge, inverter, LED ballast, automotive lighting, and so on.
Aerospace Sector
The aerospace sector has a high sealing requirement for materials. GALLOP INNOTEK epoxy potting compound can withstand extreme environments to seal or repair electronic components for aircraft and satellite equipment.
