GTP-PG010 Thermal Conductive Potting Gel
GTP-PG010 is a 2-component addition cured silicone encapsulant which will not depolymerize when heated in confined spaces. It exhibits high thermal conductivity, low stress and superior environmental resistance, and also keeps good elasticity under a wide range of temperatures in operation scenarios. Also, its low CTE can help alleviate the inner structural force to avoid failures of electronic components (eg. Bending, cracking)Based on our specially designed formulation, it can be applied without pre-treated primer with firm adhesion to aluminum and PC surfaces to meet high standards of waterproof requirements. Furthermore, It can be used at room temperature or heat cured for maximum adhesion.
Features & Benefits
- Optimum thermal conductivity: 0.8W/m.K
- Automatic & quick air bubble emission
- Low viscosity for ease mixing and potting job
- No shrinkage when curing and rapid curing time
- required
- No corrosion or oxidation to any contact surfaces
- Primer less and excellent bonding strength
Typical Applications
- On-board charger, Inverter, LED ballast
- Converter, PV modules
- Transformer, high power battery packs, UPS
Remarks:
- Shelf-life can be 12 months in original container
- Available packaging: 1kgs/can, 10kgs/can etc.
Working instructions
- Ensure parts are clean, dry and free from oil and grease.
- Dispense product to ensure both sides are flowing freely.
- Add mix nozzle to cartridge and purge one nozzle length worth of sealant to ensure fully mixed product.
- Dispense product into cavity until fully encapsulated.
- For accelerating the curing process and enhancing the bonding strength, it’s required to proceed with heating in Chambers or other instruments.
Handling precautions
- This is a platinum cure system product.
- The catalyst can be deactivated by exposure to sulfur containing compounds like thiols, sulphides, sulphates, organic rubber containing, sulphur, phosphorus, nitrogen containing compounds like amines, amides, imides, azides, lead, mercury, Arsenic, tin metals, tin compounds or tin cured RTV’s
- The fillers might be gradually settled down after storage for long periods. It is recommended to stir evenly to maintain the same
performance as originally
- Data Sheet
| T (min) | Viscosity (cps) |
| 0 | 3300 |
| 60 | 5200 |
| 90 | 10000 |
| 120 | Fully-cured |
| Item | Unit | GTP-PG010A | GTP-PG010B |
| Color (Original) | – | Black | White |
| Viscosity (Original) | Cps | 3300±500 | 3300±500 |
| Mixing Ratio | – | — | 1:1 |
| Color (Mixed) | – | — | Dark Grey |
| Viscosity (Mixed) | Cps | — | 3300±500 |
| Density (Mixed) | g/cc | — | 0.67±0.05 |
| Operation Time | Mins | — | 6/-90 |
| Curing Time @ 80°C/100°C | Mins | — | 30/20 |
| Hardness (Post-cured) | Shore A | — | 25±5 |
| Thermal Conductivity | W/m.K | — | 0.8 |
| Dielectric Strength | KV/mm | — | ≥15 |
| Volume Resistance | Ω-cm | — | ≥1.0×10¹³ |
| CTE | m/m.k | — | ≤2.2×10-4 |
| Shear Strength (with AL) | Mpa | — | 0.28 |
| Service Temperature | °C | — | -60 to 150 |
| Flame Rating | UL94 | — | V-0 |
Remarks: It is available to modify viscosity/color/curing time following specific requirement from customers.
