What is a Phase Change Thermal Pad
Traditional thermal grease and thermal pads have been used for years in the electronics industry’s thermal management solutions. These seemingly precise thermal conductivity products still have limitations. For example, grease can easily leak out or dry out, while your soft pads can experience compression and rebound under prolonged high temperatures. To address these shortcomings, the GALLOP INNOTEK phase change thermal pad was developed, representing a significant breakthrough in the field of electronic heat dissipation materials.
GALLOP INNOTEK Phase Change Thermal Pad is a heat dissipation material that automatically adjusts to temperature. At room temperature, it remains solid, just like a standard pad. This can make it easier for you to cut, transport, and install. As the device heats up to 50-65°C, it gradually softens and flows into the tiny gaps between your device and heat sink. This fully fills the interface, eliminates air pockets, and allows for smoother heat transfer.
In short, it automatically enters its optimal operating state at critical temperature points, thereby reducing thermal resistance and enhancing heat dissipation efficiency.
Core Advantages of Phase Change Thermal Pads
Here are the pain points with the old thermal conductive materials that your users might also have experienced:
Thermal Paste: It has a certain heat dissipation. During mass production, heat dissipation efficiency is not high. Thermal paste will pump out, peak, flow out of shape, and not solidify. Its thermal conductivity is low, making it difficult to use in volume production, and its maintenance is complex.
Soft Thermal Pads: They can be fitted relatively easily, but the interface fit is not as tight, the thermal conduction is not as good as the thermal grease, and the heat resistance is relatively high.
Graphite Sheets: Lightweight, thin, and high-performance, but a special design is necessary for the installation.
Gallop Innotek phase change thermal pads are the combination to get the best of both:
While traditional gaskets require prep and adhesives, Gallop Innotek Thermal pads are inherently tacky and easy to position on the CPU and LED for a perfect fit. In addition, their heat dissipation effect is comparable to that of the top thermal paste, with stable performance, resistance to cracking, and minimal drying. That is, your users have high performance (acoustics, gasoline mileage, acceleration, and so forth) and easy handling (reload/unload, fold, ride), and durability ( long life ) at the same time.
In addition to offering significant advantages over other gaskets, GALLOP INNOTEK Phase Change Thermal Pads also feature the following:
Intelligent Phase Change Properties: Stable and easy to operate at room temperature; automatically softening at operating temperature, fully wetting the interface, and delivering superior thermal conductivity to standard gaskets.
Low Thermal Resistance: GALLOP INNOTEK Phase Change Thermal Pads significantly reduce the thermal resistance of the contact interface, approaching that of high-quality thermal pastes, while also avoiding defects such as pumping out and cracking.
Installation and Reliability: The solid form of GALLOP INNOTEK Phase Change Thermal Pads facilitates assembly and mass production, ensuring long-term stable operation of your equipment. They are non-volatile and oil-resistant, resulting in low maintenance costs.
Environmental Protection and Certification: RoHS/REACH compliant, meeting global environmental requirements for electronic products.
- Fair good thermal conductivity: 3.0W/m.K
- Good insulation and high reliability
- Ultra low bond-line thickness available after melting
- High deflections and flexibility to irregular gaps filling
- Easy assembly and less messy than grease
- Cost-saving solutions
- No pump-out in aging
- Fair good thermal conductivity: 2.0W/m.K
- Good insulation and high reliability
- Ultra low bond-line thickness available after melting
- High deflections and flexibility to irregular gaps filling
- Easy assembly and less messy than grease
- Cost-saving solutions
- No pump-out in aging
- Fair good thermal conductivity: 5.0W/m.K
- Electrically conductive and high reliability
- Ultra low bond-line thickness available after melting
- High deflections and flexibility to irregular gaps filling
- Easy assembly and less messy than grease
- Cost-saving solutions
- No pump-out in aging
- Fair good thermal conductivity: 6.0W/m.K
- Good insulation and high reliability
- Ultra low bond-line thickness available after melting
- High deflections and flexibility to irregular gaps filling
- Easy assembly and less messy than grease
- Cost-saving solutions
- No pump-out in aging
- Fair good thermal conductivity: 8.5W/m.K
- Good insulation and high reliability
- Ultra low bond-line thickness available after melting
- High deflections and flexibility to irregular gaps filling
- Easy assembly and less messy than grease
- Cost-saving solutions
- No pump-out in aging
- High thermal conductivity: 8.5W/m.K
- Ultra low bond-line thickness
- Outstanding wettability and gap filling
- Good aging stability for long term applications
- Cost-saving solutions
- No pump-out in aging
- High latent heat≥140J/g
- Good insulation and high reliability
- Available for modified PCM transition temperature
- Softening surface and lower thermal impedance after absorbing heat
- Customizable for molding structures according to specific drawings
- High thermal conductivity: 8.5W/m.K
- Ultra low bond-line thickness
- Outstanding wettability and gap filling
- Good aging stability for long term applications
- Cost-saving solutions
- No pump-out in aging
How Phase Change Thermal Pad Works
GALLOP INNOTEK phase change thermal pad (PCM-PAD) is designed to behave differently at different temperatures:
At Room Temperature, the material is in a solid-like state. This makes you easy to handle, cut, and place during assembly, just like a normal thermal pad.
At Operating Temperature (50–65°C), the pad softens or partially melts (phase change). It flows slightly to fill microscopic surface irregularities between the heat source (such as the CPU, GPU, or power device) and the heat sink. This eliminates air gaps, which are poor thermal conductors.
During continuous operation, once the material has conformed, it maintains a low thermal resistance path. This ensures your devices’ efficient heat transfer, stability, and long-term reliability without pump-out or drying issues (unlike thermal grease).
In short, GALLOP INNOTEK PCM Thermal Pads combine the easy handling of pads with the high performance of thermal grease.
Parameters
Phase Change Temperature: 50 – 65°C
Thermal Conductivity: 2.5 – 8.5 W/m·K
Thickness Range: 0.06 – 0.5 mm
Operating Temperature Range: -40 ~ 125°C
Flammability: UL94 V0
Features:
Low thermal resistance
Excellent reliability (no pump-out, no dry-out)
Easy handling before installation
RoHS/REACH compliant
Typical Applications of Phase Change Thermal Pads
CPU/GPU: GALLOP INNOTEK phase change thermal pads can prevent overheating and frequency throttling, stabilizing system working.
Memory & Power Modules: GALLOP INNOTEK phase change thermal pads maintain stable operation under extremely high loads, efficiently dissipate heat, and ensure performance remains stable as heat increases.
Communication and Power Equipment: GALLOP INNOTEK phase change thermal pads can be used to manufacture 5G base stations and data center servers, thereby minimizing the risk to normal equipment operation and providing the best solution for thermal management.
New Energy Vehicle Electronics: GALLOP INNOTEK phase change thermal pads ensure temperature balance and reliable temperature control when used in batteries, BMSs, and inverters, thereby improving safety protection performance.
Conclusion
GALLOP INNOTEK Phase Change Thermal Pad is more than just a thermally conductive material; it represents an intelligent thermal management solution. It combines the high performance of traditional thermal paste with the convenience of a pad, automatically optimizing interfacial contact at critical temperatures to significantly reduce thermal resistance, thereby improving device stability and lifespan. In future electronic applications requiring high power density and reliability, GALLOP INNOTEK Phase Change Thermal Pads will become the ideal choice for an increasing number of companies and users.
