What is Thermal Adhesive
GALLOP INNOTEK thermal adhesive is an adhesive with thermal conductive properties. It helps to dissipate heat by firmly bonding two surfaces and, at the same time, transferring heat efficiently.
Thermal Adhesive Properties
GALLOP INNOTEK thermal adhesive effectively transfers heat away from sensitive components, thanks to its advanced filler blend, which contains aluminum oxide, aluminum nitride, and other materials. This high thermal conductivity helps maintain optimal operating temperatures, supporting the reliability of your device.
The adhesive forms strong, lasting bonds between parts. After curing, it creates a stable connection that withstands physical stress and environmental factors over time, supporting product durability.
Electrical insulation is another key feature, making the adhesive suitable for various electronic applications. It helps prevent short circuits and enhances the safety of assembled devices.
Its flexible nature allows the adhesive to conform closely to uneven or complex surfaces. This ensures full coverage and improves heat transfer between mated components.
GALLOP INNOTEK thermal adhesive also performs reliably at elevated temperatures, maintaining its key properties under demanding conditions, which is essential for high-power or continuous-operation applications.
Types of Thermal Adhesive
Thermal Adhesive Glue/Paste
GALLOP INNOTEK Thermal Adhesive glues/pastes are usually liquids or pastes that you mix and apply to the surface. Due to its strong flow properties, it can cover uneven textures on the surface. When cured, it is very strong and conducts heat efficiently. However, once it has cured, it is best not to disassemble it, as this can damage your components.
Thermal Adhesive Pad
GALLOP INNOTEK thermally adhesive pads are soft and flexible, allowing them to conform closely between heat-generating components and heat sinks. GALLOP INNOTEK is available in a range of thicknesses. These pads can effectively fill air gaps and accommodate dimensional variations. It absorbs heat from the element and transfers it to the heat sink. However, it has a low bond strength and relies primarily on external pressure to maintain its position.
Thermal Adhesive Tape
GALLOP INNOTEK thermal adhesive tape is processed into rolls or sheets of double-sided adhesive. It can be used to fill uneven surfaces, allowing components and heat sinks to fit tightly. It is easy to handle, does not require curing, and can be used to fix large areas. It can also be cut into various complex shapes.
How to Use Thermal Adhesive
- Surface Preparation: Before application, thoroughly clean all components and heat sinks to remove dust, oil, and other contaminants. This step is crucial for achieving strong and durable adhesion.
- Mixing or Sizing: For two-part GALLOP INNOTEK thermal adhesive paste, mix both components thoroughly in the specified ratio until a uniform color and consistency are achieved. For thermal adhesive tapes or pads, cut them accurately to match the size and shape of the component before
- Press the heat sink firmly onto the component to evenly distribute the glue. When using pre-formed tapes or pads, apply steady pressure across the entire surface to ensure complete contact without gaps.
- Curing: The GALLOP INNOTEK thermal adhesive glue or paste requires curing. You should follow the instructions and wait for it to fully cure by maintaining pressure at room temperature or under heat.
Thermal Adhesive Applications
Electronic Equipment
GALLOP INNOTEK thermal adhesive holds CPUs, GPUs, chips, and heatsinks or device housings in place. Used in mobile phones, tablets, and computers, it transfers the heat generated by these devices during operation and helps keep them stable.
Power Supply Components
Power adapters, EV controllers, and other power supply boards often generate significant heat. GALLOP INNOTEK thermal adhesive effectively transfers this heat away while providing electrical insulation, enhancing both thermal performance and circuit safety.
LED Lighting
GALLOP INNOTEK thermal adhesive is often used to secure LED chips and facilitate heat dissipation, thereby extending their service life.
Automotive Electronics
GALLOP INNOTEK thermal adhesives are used in automotive engine controls, on-board chargers, battery management systems, and lighting applications, where their strong adhesion and high thermal conductivity not only withstand vibrations and shocks but also maintain stable circuit operation.
Communication Equipment
GALLOP INNOTEK thermal adhesive securely bonds critical components, including high-power RF modules, base station chips. By effectively transferring heat away from these devices, it helps prevent overheating and ensures stable, long-term operation in electronic communication systems.
Choose the Right Thermal Adhesive
Thermal Conductivity
The higher the thermal conductivity of GALLOP INNOTEK thermal adhesive, the better it conducts and dissipates heat; however, this also makes it more expensive. Choosing the right thermal adhesive with the appropriate conductivity for your equipment’s thermal requirements ensures that it will keep your electronics functioning properly while balancing your budget.
Adhesive Strength
If your equipment is subjected to vibration and shock during use, choose the stronger GALLOP INNOTEK thermal adhesive, allowing it to provide adequate structural support for heat sinks and components.
Thickness
Select the appropriate thickness of GALLOP INNOTEK thermal adhesive according to the gap size of the electronic components. Additionally, if the surface of your components has a high or low profile or is not smooth, selecting a thicker thermal adhesive will achieve a better bonding effect and enhance the thermal conductivity efficiency.
Electrically Insulated
Electrically insulating GALLOP INNOTEK thermally adhesives ensure that the heat sink itself does not become part of the circuit, thus safeguarding the electrical performance of the original design. Therefore, depending on the application, choose a thermally insulating adhesive to ensure the safety and reliability of your equipment.
Removability
GALLOP INNOTEK thermal adhesive glue forms a powerful, permanent bond after curing. Attempting to remove it will typically damage the components or the substrate it’s attached to. Therefore, for parts that require regular replacement or servicing, it is more practical to select a thermal interface material designed for nondestructive removal.
Thermal Adhesive Bondline & Mix Planner
Estimate adhesive volume, total mass and two-part mix quantities for a production lot.
Planning/reference estimate: Use the selected product data sheet for mix ratio, pot life, cure profile and bondline control. This is not a production mixing instruction.
Thermal adhesives are used high high-temperature environments. They are specifically formulated and tested to resist degradation in demanding conditions, including exposure to high temperatures and UV radiation, ensuring reliable long-term performance.
Thermally adhesive is a bonding material with thermal conductivity. It provides both adhesion and thermal conductivity. Thermally conductive silicone grease is a thermal interface material that fills in between components to conduct and dissipate heat and does not have adhesive properties.
Curing is a critical step required for many thermal adhesives, particularly thermally conductive glues and pastes. The specific curing conditions, including time, temperature, and pressure, vary significantly based on the adhesive’s chemical composition. It is essential to adhere to the manufacturer’s guidelines, as certain formulations achieve full cure at room temperature, while others require exposure to high temperatures to develop optimal bond strength and thermal properties.
