What is a thermally conductive insulator
GALLOP INNOTEK thermal insulator has both high thermal conductivity and high electrical insulation. Thermal conductivity refers to the ability to effectively transfer heat through lattice vibrations or free electrons. Electrical insulation means that there are almost no freely moving charges inside a thermal insulator, which can effectively block the passage of current. If you require materials that offer both thermal conductivity and electrical insulation, GALLOP INNOTEK can meet your needs.
Characteristics of Thermal Insulators
High thermal conductivity: GALLOP INNOTEK thermal conductive insulators have a relatively high thermal conductivity and can quickly transfer the energy of the heat source away. Its thermal conductivity is much higher than that of common insulating materials such as plastics and rubber. The thermal conductivity of high-performance materials, such as aluminum nitride and boron nitride, can be comparable to or even higher than that of metals.
High electrical resistivity: GALLOP INNOTEK thermal conductive insulators have an extremely high volume resistivity, which can effectively block current and prevent short circuits.
Mechanical Properties: GALLOP INNOTEK thermal conductive insulators have good mechanical strength, hardness, and wear resistance. Typically, they exhibit high compressive strength and offer effective structural support.
Heat stability: GALLOP INNOTEK thermal conductive insulators can maintain the stability of their physical and chemical properties in a high-temperature environment and are not prone to decomposition or melting even when working for a long time in a high-temperature environment.
Chemical Stability: Most materials used in GALLOP INNOTEK thermal conductive insulators exhibit characteristics of corrosion resistance and oxidation resistance. They are not prone to reacting with water vapor, oxygen, or other substances in the surrounding environment, which ensures their reliability for long-term use.
- Superior thermal conductivity: 6.0W/m.K
- High insulation compatibility
- Endurable for wear and abrasion
- Able to withstand high closure force
- Good reworkability and low friction surface
- Ultra low VOC and outgassing concerns
- Silicone free
- Superior thermal conductivity: 5.0W/m.K
- High insulation compatibility
- Endurable for wear and abrasion
- Able to withstand high closure force
- Good reworkability
- Ultra low VOC and outgassing concerns
- Cost-saving solutions
- Superior thermal conductivity: 3.0W/m.K
- High insulation compatibility
- Endurable for wear and abrasion
- Able to withstand high closure force
- Good reworkability
- Ultra low VOC and outgassing concerns
- Cost-saving solutions
- Good thermal conductivity: 1.8W/m.K
- High insulation compatibility
- Endurable for wear and abrasion
- Able to withstand high closure force
- Good reworkability
- Ultra low VOC and outgassing concerns
- Cost-saving solutions
- Good thermal conductivity: 0.9W/m.K
- High insulation compatibility
- Endurable for wear and abrasion
- Able to withstand high closure force
- Good reworkability
- Ultra low VOC and outgassing concerns
- Cost-saving solutions
- Good thermal conductivity: 1.3W/m.K
- High insulation compatibility
- Endurable for wear and abrasion
- Able to withstand high closure force
- Good reworkability
- Ultra-low VOC and outgassing concerns
- Cost-saving solutions
- Good thermal conductivity: 1.7W/m.K
- High insulation compatibility
- Endurable for wear and abrasion
- Able to withstand high closure force
- Good reworkability
- Ultra low VOC and outgassing concerns
- Cost-saving solutions
- Good thermal conductivity: 0.9W/m.K
- High insulation compatibility
- Endurable for wear and abrasion
- Able to withstand high closure force
- Good reworkability
- Ultra low VOC and outgassing concerns
- Cost-saving solutions
What type of materials are used for thermal insulators?
The key to achieving thermal insulation lies in utilizing phonons—quantum vibrations of the crystal lattice—to conduct heat rather than relying on electrons. Consequently, such materials typically possess highly ordered crystal structures that minimize resistance to phonon propagation.
Ceramic Materials
Alumina offers a low cost, high mechanical strength, excellent electrical insulation, and mature processing techniques. However, its thermal conductivity is relatively low, making it widely used in cost-sensitive applications and scenarios with low thermal conductivity requirements. Considering cost-effectiveness, this is a good material choice.
Aluminum nitride: Its thermal conductivity approaches that of metallic aluminum, making it exceptionally high, while also offering excellent electrical insulation properties. However, it is costly and challenging to process, and it readily undergoes hydrolysis in humid environments. If your product is a high-probability and high-frequency electronic component, Aluminum nitride is suitable for you.
Boron nitride: Hexagonal boron nitride features a graphite-like structure and exhibits self-lubricating properties, making it an excellent thermal conductive insulating sheet material. Cubic boron nitride is an ultra-hard material with exceptional chemical stability.
Beryllium oxide: Although it possesses extremely high thermal conductivity, it is highly toxic, and its dust poses significant health hazards to humans. Consequently, its use has become rare, limited to certain specialized military and aerospace applications.
Polymer Composites
Pure polymers are typically heat conductors, but adding high thermal conductivity insulating fillers can significantly enhance their thermal conductivity, thereby improving the performance of your products.
Typically, ceramic powders such as aluminum oxide, aluminum nitride, boron nitride, or alumina are added to silicone, epoxy resins, or plastics to improve thermal conductivity. These materials can be used to produce thermal conductive adhesives, thermal pads, thermally conductive plastic housings, and thermal potting compounds, offering excellent processability and flexibility.
Diamond
Diamond is the material with the highest known thermal conductivity in nature and is also an excellent insulator, but it is costly and difficult to process. Therefore, it is mainly used in some extreme heat dissipation scenarios, such as the heat dissipation substrate of high-power lasers and microwave equipment.
Single-Crystal Material
The crystal structure of single-crystal alumina is very complete. It has less phonon scattering, resulting in a significantly higher thermal conductivity compared to polycrystalline alumina; however, the cost is also higher.
The materials used in GALLOP INNOTEK thermal conductive insulators are diverse, allowing them to meet various requirements, including cost and performance.
Advantages of Using Thermally Insulating Materials
Resolve conflicts: GALLOP INNOTEK thermal conductive insulators perfectly resolve the core contradiction between the need for heat dissipation and the necessity of insulation in electronic devices, which promotes the miniaturization and integration of devices without worrying about overheating and insulation issues.
Enhance reliability: Through efficient heat dissipation, GALLOP INNOTEK thermal conductive insulators significantly reduce the core operating temperature of electronic components, thereby extending the service life and long-term reliability of the products.
Ensure safety: The high insulation property of GALLOP INNOTEK thermal conductive insulators ensures the safety of high-voltage circuits and users, effectively preventing the occurrence of electric shock and short-circuit accidents.
The application of thermal conductive insulators
Microelectronic Packaging: Thermal grease between CPU, GPU, ASIC chips, and heat sinks, phase change material, and Integrated circuit packaging substrate.
Power Electronics: Ceramic insulating substrates for power modules such as IGBT and power MOSFET, including DBC substrates and AMB substrates.
LED Lighting: Substrates for high-power LED chips, COB packaging, and heat sink housings for lighting fixtures.
Power Module: Heat dissipation insulation sheets, heat dissipation insulation plates in frequency converters, thermal Conductive Potting Compound.
New Energy Vehicles: Thermal insulation spacers between battery cells in the power battery pack, heat dissipation for the onboard charger, and an electronic control unit.
Communication Equipment: Thermal Management and Insulation for RF Power Amplifier Devices in 5G Base Stations.
Aerospace: Airborne radar, electronic warfare systems, satellite communications equipment.
GALLOP INNOTEK thermal conductive insulators have a wide range of applications. Whether you are in the electronics, automotive, or aerospace industries, GALLOP INNOTEK thermal conductive insulators can enhance the lifespan and performance of your system.
