What is the Vapor Chamber Heat Sink
GALLOP INNOTEK vapor chamber heat sink is a heat pipe cooling device. It consists of a vacuum-sealed copper plate forming a chamber, and a small amount of liquid is added. Heat is transferred by evaporation and condensation of the liquid in the chamber. It is often integrated into high-power devices to provide you with superb heat dissipation.
Advantages of Vapor Chamber Heat Sink
High Thermal Conductivity: The main material of the GALLOP INNOTEK vapor chamber heat sink is copper, which has high thermal conductivity. It is in direct contact with the heat source and heat sink, providing efficient heat transfer. The fluid inside the chamber is also highly thermally conductive and circulates continuously to transfer and dissipate heat quickly.
Uniform Heat Dissipation: The evaporated water vapor can be evenly distributed throughout the chamber, ensuring that all higher-temperature areas of the heating element are cooled, effectively preventing your equipment from overheating locally.
Lightweight: It will also be lighter and bring more heat dissipation than a pure copper heatsink. If you’re choosing a heatsink for a portable electronic device, it’s a good choice.
Thin: The GALLOP INNOTEK vapour chamber heat sink can achieve very thin dimensions without occupying excessive space.
Widely Applicable: GALLOP INNOTEK offers a wide range of vapor chamber heat sinks in various shapes and sizes, allowing for integration into equipment across multiple industries. You can also request that they be filled with different fluids to meet performance requirements.
Manufactured ultra thin with cooler, with aluminum fins for heatsink. Customizable printing methods available.
Available customizable bending services and materials. Promotional branding can be added for preference.
Heatsink product with alternate material available for preference and addition.
Cooling plate feature for high and heavy processing servers, Alternation for the product can be added.
Engineered heat sinks with vapor chamber etched cooling feature on plates. Can be produced in copper and with a promotional logo.
Accessory heatsink manufactured in aluminum and copper materials available for preference and customization.
Heatsink vapor chamber for portable devices and has auto-cooling feature. Specifications for devices can be added.
Customizable vapor chamber with various material components for improvement, Optimizes cooling change capability.
What is the Vapor Chamber Heat Sink?
GALLOP INNOTEK vapor chamber heat sink is a heat pipe cooling device. It consists of a vacuum-sealed copper plate forming a chamber, and a small amount of liquid is added. Heat is transferred by evaporation and condensation of the liquid in the chamber. It is often integrated into high-power devices to provide you with superb heat dissipation.
Components of a Vapor Chamber Heat Sink
- Base Plate: The base plate fits snugly over the heating element, transferring the generated heat to the GALLOP INNOTEK vapor chamber heat sink. It is usually made of high thermal conductivity copper.
- Cavity Interior: The interior of the cavity is typically constructed using both copper powder sintering and multi-layer through-mesh technology. The unique structure ensures uniform distribution of the liquid and prevents localised overheating from affecting or even damaging your equipment.
- Fluids: Fluids are used to absorb and transfer heat. You can select different fluids based on your performance requirements. Water is often used as a liquid because it has high thermal conductivity and is relatively inexpensive.
- Heat Sink: The liquid will evaporate into water vapour and transfer the heat to the radiator. And the heat sink will act as a passive heat sink, rapidly reducing the temperature.
How does the Vapor Chamber Heat Sink Work？
- Capillary structure: The GALLOP INNOTEK vapor chamber heat sink is designed as a flat, fragile structure. It features a capillary structure inside the chamber, enabling the liquid to be evenly distributed throughout.
- Evaporation: Your equipment generates a significant amount of heat when it operates, and this heat warms the liquids inside the homogenizing plate. These liquids will evaporate at a lower temperature, generating water vapour and spreading it throughout the chamber.
- Transfer heat: This water vapour rapidly absorbs and transfers the heat generated by the heating element. The water vapour then flows to the lower temperature end due to pressure, releasing heat and condensing into a liquid. Finally, the liquid returns to the heat source, and the process is repeated.
- Heat Dissipation: Heat is transferred by water vapor to the heat sink, and the temperature is quickly reduced through passive heat dissipation. Thus, maintain your equipment at normal temperature.
Types of Vapor Chamber Heat Sink
- Versatile Two-Piece Vapor Chamber: The versatile two-piece vapor chamber is a traditional vapor chamber heat sink. It utilizes two stamped plates and features a more flexible shape, allowing for use in the complex interiors of equipment. However, it is more costly.
- No secondary processing is required, and it features a one-piece construction, which reduces thermal resistance and improves performance. It is cheaper and simpler to produce, is a cost-effective choice for you.
- Ultra-Thin Vapor Chambers: Ultra-thin vapor chambers are thinner than normal vapor chamber heat sinks, providing strong heat dissipation in space-constrained environments. But it is mechanically less strong and prone to deformation.
- Machined Vapor Chambers: Machined vapor chambers can be used to dissipate heat from multiple heat sources within a facility. A single machined vapor chamber can be connected to multiple heat sources. It not only provides high power heat dissipation, but also enhances space utilisation.
- 3D Vapor Chamber: A 3D vapor chamber is an advanced cooling solution. It achieves superior cooling efficiency by increasing the volume of heat diffusion. You can use it for ultra-high-power devices with precise temperature control.
Applications of Vapor Chamber Heat Sink
- Wearables: Wearables must be powerful yet compact in design. Therefore, it must utilize heat sinks that dissipate heat quickly, are lightweight, and are thin. Thin vapour chamber heat sinks can be your ideal choice.
- High-Density Servers: The GALLOP INNOTEK vapour chamber heat sink provides heat dissipation for multiple heat-generating components. Used in high-density servers, it is an effective solution to your space utilisation problems.
- Computers and Data Centres: Computers and data centres generate a lot of heat when in use. It requires the extremely high performance of the GALLOP INNOTEK vapour chamber heat sink to provide even heat dissipation and a long service life.
- High-end electronics: Utilizing GALLOP INNOTEK vapour chamber heat sinks in electronic equipment ensures a stable and reliable product.
- Telecommunications: GALLOP INNOTEK vapour chamber heat sinks maintain good stability in more demanding environments. Therefore, it can be used in telecom base stations to meet the durability requirements.
- Aerospace: GALLOP INNOTEK vapour chamber heat sinks are lightweight and efficient, and are commonly used in the aerospace industry to dissipate heat from electronic equipment, ensuring that it operates properly in harsh environments.
The chamber of a traditional heat pipe is a sealed metal tube filled with water. Whereas vapour chamber heat sinks have a capillary structure. In operation, they both absorb and transfer heat through water vapour. However, due to the difference in internal structure, vapour chamber heat sinks can make up for the shortcomings of traditional heat pipes to achieve more uniform heat dissipation and avoid localised overheating.
Vapor chamber can be used with many types of heat sinks to give you a different experience. They are usually fixed by soldering, adhesive bonding, mechanical connection and so on. Solder with good thermal conductivity can be used to secure the radiator, but the high temperatures involved in the soldering process can affect the panels. Adhesives and mechanical joints are suitable for fixing a wide range of radiators, while mechanical joints give better mechanical strength to the vapor chamber heat sink.
