GTP-PG018 REV01 Thermal Conductive Potting Gel
Description
GTP-PG018 Rev01 is a 2-component epoxy-based encapsulant material which can be cured in room temperature or heat-accelerated conditions. It exhibits high thermal conductivity, short tack-free time, and superior environmental resistance. After curing process, it can be very hard and thus exhibit a much lower CTE to better accommodate various designs and avoid failures of electronic components.
Features & Benefits
- Optimum thermal conductivity: 1.8W/m.K
- Automatic & quick air bubble emission
- Low viscosity for ease mixing and potting job
- No corrosion or oxidation to any contact surfaces
- Primer less and excellent bonding strength
Typical Applications
- Motors, capacitors, transmitter
- Transformer, high power battery packs, UPS
Remarks:
- Shelf-life can be 12 months in original container
- Available packaging: 1kgs/can, 10kgs/can etc.
Operation Instructions
- Blasting the rust/oxidation layer of the metal surface and clean with solvents/agents without residues; apply this encapsulants right after it’s getting dry.
- When mixing, please stir the mixture by unidirectional way to avoid much air penetrating inside and ensure the mixing time to have enough mixing of both base material and curing agents. Additionally, it’s recommended to work with automatic mixing equipment.
- Please follow the curing time as listed above and extend the curing time if temperature is lower than 25°C. By heat-accelerated method, it can optimize the adhesion and the best performance can be achieved after keeping 30mins at 80-100°C.
- After curing for 24hrs, it can be processed by machining, grinding, drilling, tapping etc. to fulfill your desired dimensions
More Details
- Data Sheet
| Item | Unit | GTP-PG018A | GTP-PG018B | |
| PHYSICAL | Color (Original) | – | Black | Light Yellow |
| Density (Original) | g/cc | 1.52 | 1 | |
| Viscosity (Original) | Cps | 8000±500 | 150±20 | |
| Mixing ratio (by weight) | – | — | 5:01 | |
| Color (Mixed) | – | — | Black | |
| Viscosity (Mixed) | Cps | — | 2000±200 | |
| Density (Mixed) | g/cc | — | 1.65±0.02 | |
| Operation time | Min | — | 60 | |
| Curing time @ RT | Hrs | — | 24 | |
| Curing time @ 80°C | Min | — | 30 | |
| THERMAL | Hardness (Post-cured) | Shore D | — | 85±5 |
| Thermal Conductivity | W/m.K | — | 1.8 | |
| Dielectric strength | KV/mm | — | ≥20 | |
| Volume resistance | Ω-cm | — | ≥1.0×10¹⁵ | |
| Elongation | % | — | >5 | |
| Tensile strength | Mpa | — | >50 | |
| Service temperature | °C | — | ≤1.0×10-⁴ | |
| Flame rating | UL94 | — | V-1 |
