Why Choose Our Ultra Thin Copper Foil？
Ultra Thin Copper Foil Manufacturer for High-Density & Flexible Electronics
- 10+ years of expertise in ultra thin copper foil production and a dedicated R&D team
- Running Quality Systems:IS09001:2008, IS014001, IATF16949, IS045001
- Precise thickness control, same thickness in all batches
- Quality monitoring is conducted through standard operating procedures to ensure the quality of finished products.
- Comprehensive support from bespoke solutions to delivery across all sectors
- Supports rapid prototyping, with large-scale manufacturing orders enabling swift delivery
Your Reliable Ultra Thin Copper Foil Supplier
As a leading ultra thin copper foil manufacturer in China, GALLOP INNOTEK provides one-stop services from specification selection to delivery for high-density, flexible and space-constrained electronic applications. Our copper foil reliably functions in applications including flexible printed circuits (FPC), high-density interconnect (HDI) boards, electromagnetic interference/radio frequency interference (EMI/RFI) shielding, and advanced electronic components. With efficient high-volume production capabilities and stringent quality and tolerance control standards, we stand ready to become your long-term partner.
Features of Ultra Thin Copper Foil Supplier
With a thickness of approximately 3~9μm, it can be readily used in intricate and compact structural designs.
High conductivity effectively reflects interfering electromagnetic waves, suitable for high-frequency signal applications.
Thermal conductivity exceeding 500 W/m·K, efficiently dissipates heat from heat-generating components.
A smooth surface and minimal thickness further enhance signal transmission stability and integrity.
Copper materials exceeding 99.9% content, minimising the influence of other alloying elements and impurities.
Enhanced ductility allows greater resistance to repeated bending cycles and extended service life.
The extremely thin thickness simplifies processing operations such as lamination and bonding, while also reducing the risk of defects.
Multiple thicknesses and dimensions available. We can supply sheet metal, stamped parts, or laser-cut components, among others.
Quality Control in Mass Production
GALLOP INNOTEK has 5+ in-house testing laboratories equipped with apparatus for measuring thermal resistance, thermal conductivity, impedance, ageing, hardness and other properties. All ultra thin copper foils leaving our premises undergo over 30 inspection steps, ensuring stringent control of finished product quality standards. Furthermore, our factory has IR detection monitoring systems for tolerance control. Consequently, we can provide consistently high-quality products for your high-volume production.
Outstanding Machinability
Ultra thin copper foil has better ductility and bend resistance, resulting in reduced deformation and damage during subsequent processes such as lamination and bonding, thereby lowering scrap rates. Furthermore, this foil integrates seamlessly into automated processing equipment, achieving more efficient production. Our ultra thin copper foil features uniform thickness and high etching compatibility, minimising the risk of short circuits.
Customisation Capabilities
The thickness of ultra thin copper foil (3~9μm), surface treatment (single-sided/double-sided treatment, roughening, etc.), and supply form (coils, strips, die-cut components) can all be customised. We have a professional design and experimental team with extensive experience in many industries, such as electronics, energy, and automotive. We can provide selection support and rapid prototyping services to minimise cycle delays and cost losses caused by mismatches.
Applications of Ultra Thin Copper Foil Supplier
Meets the requirements for complex processing and repeated bending of flexible printed circuit boards, and can be used to enhance the conductivity of conductive layers.
You can use ultra thin copper foil in HDI and PCB applications to achieve finer line spacing, thereby getting products with high quality and reliability.
Enhance signal transmission efficiency and operational stability whilst maintaining lightweight and compact design.
Ultra thin copper foil minimises impedance, further reducing signal transmission loss in communications, high-speed circuits applications.
Use in conductive and EMI shielding components for micro-sensors and medical electronic devices, meeting precision design requirements while delivering high performance.
The current collector and conductive layer of batteries can use ultra thin copper foil to enhance performance and improve energy efficiency.
Ultra thin copper foil can be processed into various EMI materials for use in shielding and grounding systems, effectively suppressing electromagnetic interference.
Ultra thin copper foil typically measures 3~9μm in thickness, whereas standard thickness copper foil can reach up to 70 micrometres. Ultra thin copper foil offers better ductility and lighter weight, making it suitable for high-density, flexible electronic applications with space constraints.
Ultra thin copper foil maintains high-performance conductivity. Moreover, owing to its minimal thickness, it has lower impedance, further minimising loss of transmission and enhancing signal integrity.
You can customise the thickness, surface finish, forms, and dimensions of ultra-thin copper foil.
Certainly, ultra thin copper foil is very suitable for automated production lines to achieve high-volume, efficient manufacturing. You should control rigorous quality and tolerance.
Different applications have different requirements for ultra thin copper foil. You may select specifications such as thickness, electromagnetic shielding strength, electrical conductivity. We can recommend the best options based on your product specifications.
Ultra-thin copper foil forms a continuous conductive layer capable of reflecting and absorbing electromagnetic interference. It may also be employed for grounding, directing disruptive electromagnetic waves into the earth.
Ultra-thin copper foil may undergo surface treatment on either one or both sides. Options such as roughening and oxidation resistance treatment can be selected to enhance adhesion, corrosion resistance, and processing stability.
What is Ultra Thin Copper Foil?
Ultra thin copper foil refers to copper foil with a thickness typically less than 9μm. It is commonly used in portable and miniature electronic devices featuring intricate designs and compact structures(such as mobile phones, micro-sensors, and high-density circuitry). It typically has a smoother surface, enhanced flexibility, and higher purity. Despite its minimal thickness, it achieves exceptionally high electrical and thermal conductivity, extremely low resistance, and delivers outstanding electromagnetic shielding and heat dissipation function.
Types of Ultra Thin Copper Foil
Rolled Ultra Thin Copper Foil
Rolled ultra thin copper foil is manufactured through rolling and annealing high-purity copper, yielding superior resistance to bending, alongside a smoother surface finish. It is the best choice for flexible printed circuit boards (FPC), foldable and wearable electronic devices. This material delivers enhanced reliability and extended service life for such products.
Electrolytic Ultra Thin Copper Foil
Electrolytic ultra thin copper foil can better control thickness, resulting in copper foil with greater uniformity in thickness. Its surface is typically rougher, facilitating subsequent bonding processes (such as adhesion to substrates). Benefiting from the simplicity of the electrodeposition process, electrolytic ultra-thin copper foil offers lower initial costs. So it is a more cost-effective choice. You can choose it for applications such as high-density interconnect circuit boards and shielding layers.
Function of Ultra Thin Copper Foil
Electrical Conductivity and Signal Transmission
Ultra thin copper foil has ultra high electrical conductivity at minimal thickness, enhancing circuit transmission efficiency. Furthermore, it minimises transmission losses, safeguarding the integrity of control signals, power signals, and data signals while preventing distortion. This improves product reliability and prevents operational failures.
Grounding
Ultra thin copper foil facilitates electrical grounding for equipment or power systems, stabilising circuit impedance. This allows fault currents and static electricity to be safely diverted to earth, thereby reducing noise and crosstalk. Your products will achieve great operational stability.
Electromagnetic Shielding
Ultra thin copper foil serves as an effective electromagnetic shielding material. On the one hand, it reflects and blocks electromagnetic interference generated by other equipment or systems, preventing operational failures. On the other hand, it attenuates electromagnetic radiation emitted by equipment towards other devices, thereby enhancing electromagnetic compatibility. It can be used in electronic devices, aerospace applications, medical equipment, industrial control systems, and similar contexts.
Multi-layer Composite Structure
Benefiting from the processing flexibility of ultra-thin copper foil, it can be laminated with various substrates (such as adhesive layers, PET base films, etc.) to form functional layers within multi-layer structures. Ultra thin copper foil can perform functions such as electrical conductivity, electromagnetic shielding, and thermal conductivity within these functional layers without significantly increasing thickness or weight.
