Composite Thermal Film GTS-CU15
Description
GTS-CU series Composite Thermal Film is an ultra-thin, high-performance material crafted for effective heat dissipation. This film can exhibit excellent in-plane thermal conductivity to minimize hotspots and reduce device temperatures. Its flexible design allows it to conform to various surfaces, making it especially useful in compact devices where space and cooling are limited. It also provides strong EMI shielding, enhancing device stability and performance. These hybrid functions make it ideal for smartphones and other high-power-density electronics.
Features & Benefits
- Superior in-plane thermal conductivity
- Lightweight and ultra-thin
- Flexible and easy to be cut or trimmed
- Low thermal resistance
- EMI Shielding
- RoHS / REACH compliant
Typical Applications
- Displays, cellphone, laptops, note-pads
- Consumer and industrial electronics
- Automotive electronics,
- High-power LED lightings, SFP modules
- Telecommunications, power conversion
Remarks:
- Shelf-life can be 12 months since date of manufacture
- Supply form: Roll, Sheet, die-cut/kiss-cut parts etc.
- Standard width: 300mm
More Details
- Data Sheet
| Item | Unit | GTS-CU15 | |
| PHYSICAL | Color | – | Black |
| Thickness | mm | 0.15 | |
| Density | g/cc | 0.85 | |
| Tensile Strength | Mpa | 55 | |
| Thermal Emissivity | – | 0.85 | |
| Operating Temp. | °C | -40 ~ 150 | |
| RoHS/REACH | SGS | In-compliant | |
| Shielding Effective (10Mhz-3Ghz) | dB | $>80$ | |
| Dielectric Strength | KV/10um | $>1.0$ | |
| THERMAL | Thermal Conductivity (in-plane) | W/m.K | $>500$ |
| Thermal Conductivity (Through thickness) | W/m.K | 2.5 | |
| Thermal Resistance @ 50psi | In²-°C/W | 0.25 | |
| Thermal Diffusivity | cm²/s | 10-Sep |
