CR-ALN Ceramic Insulator
Description
Aluminum Nitride has superior thermal conductivity qualities and features low loss factors at high frequencies. It has high compressive strength, high volume resistivity, low thermal expansion and resists radiation.
Features & Benefits
- Superior thermal conductivity: 170W/m.K
- Excellent electrical insulation
- High endurability to corrosion and abrasions
- Superior mechanical strength than aluminum
- Light weight and compact designs
- High thermal shock temperature resistant up to 2200 degree celcius
- Excellent workability for assembly
- Ultra-low linear thermal expansion coefficient to fit to mechanical design, good match with of Si (3.5-4 x10- 6 ℃) and GaAs (6 x 10-6 ℃)
Typical Applications
- Laser equipment, high-power LED
- Power Transistor, Power modules
- Power supplies, UPS, Power transmission regulators
- Telecommunication equipment, STB
- Military gadgets, radar, power inverters
- Chip IC, IGBT, MOSFET etc.
Remarks:
- Shelf-life can be 24 months since date of manufacture
- Supply form: Sheet, die-cut/laser-cut parts or prelaminated with desired TIMs, metals or other materials
- Standard sheet size: 120x120mm / 140x190mm or customized shapes upon requests (tooling required)
More Details
- Data Sheet
| Item | Unit | CRxxx-ALN | Standards | |
| FORMULATIONS | ALN | % | 98 | – |
| SiO2 | % | 1.2 | – | |
| CaO | % | 0.5 | – | |
| Other oxides | % | 0.3 | – | |
| Typical physical properties | ||||
| PHYSICAL | Color | – | Grey | Visual |
| Thickness | mm | 0.385 – 3.0 | ASTM D374 | |
| Hardness | Rockwell 45N | 88 | GB/T230-91 | |
| Density | g/cc | 3.33 | GB/T 2413 | |
| Flexural Strength | MPa | ≥480 | EN12372 | |
| Warpage | Length‰ | ≤2‰ | – | |
| Surface roughness, Ra | um | 0.2 – 0.75 | GB/T 6062 | |
| Breakdown voltage | KV/mm | >28 | ASTM D149 | |
| Volume Resistivity | Ω-cm | 1.1×10¹³ | ASTM D257 | |
| Dielectric Constant | 1MHz | 10-Aug | GB/T 5594.4 | |
| Operating Temp. | °C | -60 ~ 1400 | – | |
| THERMAL | Thermal Conductivity | W/m.K | 170 | ASTM D5470 |
| Linear Coeff. of Thermal Expansion | 10⁻⁶/ 20~300°C | 2 – 3.5 | GB/T5593 | |
| Young’s modulus | GPa | 380 | – | |
| Thermal shock resistivity | °C | 2200 | EN14066+BV1:BZ22 |
