CR800-SCU-FHT Silver Copper FIP Gel (HT Cured)
Description
It offers excellent compressibility and conductivity, with strong adhesion on both metal and plastic surfaces. It is suitable for use in telecommunication base stations, optical modules, automotive electronics, radar systems, handheld devices, and consumer CR800-SCU-FHTS is a high-temperature vulcanized conductive adhesive, filled with silver-coated copper, designed for FIP (Form-in-Place applications. It works with precision dispensers to create EMI conductive gaskets. electronics for EMI dispensing applications.
Features & Benefits
- Wear-resistant and heat-resistant with high reliability.
- High-temperature curing ensures strong bonding and stable
performance. - Excellent EMI shielding with effectiveness over 100 dB.
- Single-component adhesive, easy to use and ready to apply
- Low softness option for high compression ratio
More Details
- Data Sheet
| Item | Standards | CR800-SCU-FRTS | Unit |
| Color | Visual | Lt. Yellow | – |
| Compound | – | Silicone | – |
| Filler | – | Silver-Copper | – |
| Density (Post-cured) | ASTM D792 | 2.85 | g/cm³ |
| Hardness | ASTM D2240 | 40-45 | Shore A |
| Adhesion | GALLOP | ≥10 | N/cm |
| Tensile Strength | ASTM D412 | ≥1.0 | mpa |
| Elongation | ASTM D412 | ≥100 | % |
| Compression Set | ASTM D395 | ≤30 | % |
| Working Temperature | ASTM D1329 | -55 ~ +150 | °C |
| Flammability | UL-94¹ | HB | – |
| Volume Resistance | MIL-DTL-83528C | ≤0.005 | Ohm-cm |
| Shielding Effectiveness | MIL-DTL-83528C | >110 | dB |
| Curing Temperature | – | 150 | °C |
| Curing Time | – | 30 | min |
| Storage Condition/Shelf-life | – | -20°C, 3 months | – |
1. This test should be done by clamping with AL plate.
