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CR800-SCU-FHT Silver Copper FIP Gel (HT Cured)

Description

CR800-SCU-FHT is a high-temperature vulcanized conductive adhesive, filled with silver-coated copper, designed for FIP (Form-in-Place applications. It works with precision dispensers to create EMI conductive gaskets. It offers excellent compressibility and conductivity, with strong adhesion on both metal and plastic surfaces. It is suitable for use in telecommunication base stations, optical modules, automotive electronics, radar systems, handheld devices, and consumer electronics for EMI dispensing applications.

Features & Benefits

  • Wear-resistant and heat-resistant with high reliability.
  • High-temperature curing ensures strong bonding and stable
    performance.
  • Excellent EMI shielding with effectiveness over 100 dB.
  • Single-component adhesive, easy to use and ready to apply

 

 

 

More Details
ItemStandardsCR800-SAL-FRTUnit
ColorVisualLt. Yellow
CompoundSilicone
FillerSilver/Aluminum
Density (Post-cured)ASTM D7922.2g/cm³
HardnessASTM D224060±5Shore A
AdhesionGALLOP≥10N/cm
Tensile StrengthASTM D412≥130psi
ElongationASTM D412≥180%
Compression SetASTM D395≤30%
Working TemperatureASTM D1329-55 ~ +125°C
FlammabilityUL-94¹V0
Volume ResistanceMIL-DTL-83528C≤0.01Ohm-cm
Shielding EffectivenessMIL-DTL-83528C>100dB
Curing Temperature25°C
Curing Time24hrs
Storage Condition/Shelf-life-30°C~-10°C, 3 months

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