CR800-SCU-FRT Silver Copper FIP Gel (RT Cured)
Description
CR800-SCU-FRT is a room-temperature vulcanized conductive adhesive, filled with silver-coated copper, designed for FIP (Form-in-Place applications. It works with precision dispensers to create EMI conductive gaskets. It offers excellent compressibility and conductivity, with strong adhesion on both metal and plastic surfaces. It is suitable for use in telecommunication base stations, optical modules, automotive electronics, radar systems, handheld devices, and consumer electronics for EMI dispensing applications.
Features & Benefits
- Cures at room temperature, preventing heat damage to
components. - Excellent EMI shielding with effectiveness over 100 dB.
- Single-component adhesive, easy to use and ready to apply
More Details
- Data Sheet
| Item | Standards | CR800-SCU-FRT | Unit |
| Color | Visual | Gray | – |
| Compound | – | Silicone | – |
| Filler | – | Silver-Copper | – |
| Density (Post-cured) | ASTM D792 | 3.0 | g/cm³ |
| Hardness | ASTM D2240 | 55±5 | Shore A |
| Adhesion | GALLOP | ≥10 | N/cm |
| Tensile Strength | ASTM D412 | ≥130 | psi |
| Elongation | ASTM D412 | ≥150 | % |
| Compression Set | ASTM D395 | ≤30 | % |
| Working Temperature | ASTM D1329 | -55 ~ +150 | °C |
| Flammability | UL-94¹ | V0 | – |
| Volume Resistance | MIL-DTL-83528C | ≤0.01 | Ohm-cm |
| Shielding Effectiveness | MIL-DTL-83528C | >100 | dB |
| Curing Temperature | – | 25 | °C |
| Curing Time | – | 24 | hrs |
| Storage Condition/Shelf-life | – | -30°C~-10°C, 3 months | – |
1. This test should be done by clamping with AL plate.
