GTP-AS010 Premium RTV Silicone Adhesive
Description
GTP-AS010 is a 1-part, spreadable, non-corrosive, nonflowing humidity-cured silicone thermal adhesive. The adhesive retains elastomeric properties for long periods at temperatures from -60 to 250 °C (-76 to 482°F). In addition, its low CTE can help alleviate the inner structural force to avoid failures of electronic components (eg. Bending, cracking) The GTP-AS010 is excellent for the sealing and bonding of electronic components onto printed circuit boards and protecting copper connections on electronic part assemblies. It also provides excellent heat transfer between electronic components and heatsink/casing.
Features & Benefits
- Optimum thermal conductivity: 1.0W/m.K
- Variable curing speed to fit in specific assembly conditions
- Excellent chemical and weather resistance
- Low CTE for minimizing the risk of component failure
- Primer less and excellent bonding strength
- Provides electrical insulation
Typical Applications
- Power supplies, inverter, UPS
- Converter, PV modules
- Transformer, automotive ECU
Remarks:
- Shelf-life can be 12 months in original container @ 25°C
- Available packaging: 30cc syringe, 100cc/1 L cartridge etc
More Details
- Data Sheet
| Item | Unit | GTP-AS010 | |
| Original Specifications Prior to Curing | Color | – | White |
| Viscosity | mPa.s | 500,000 – 600,000 | |
| Density | g/cc | 1.3±0.1 | |
| Tack-free time @ 25°C | Min | 30-Mar | |
| Fully-curing time @ 25°C | Hrs | 24 | |
| Extrusion Rate | g/min | 150 – 180 | |
| Post-Cured | Hardness | Shore A | 30 – 45 |
| Thermal Conductivity | W/m.K | 1 | |
| Dielectric strength | KV/mm | ≥22 | |
| Volume resistance | Ω-cm | ≥1.0×10¹⁴ | |
| Coeff. of Thermal Expansion (CTE) | m/m.k | ≤2.0×10-4 | |
| Dielectric constant | 10KHz | ≤3.0 | |
| Shear Strength (with AL) | Mpa | ≥3.0 | |
| Service temperature | °C | -60 to 250 | |
| Flame rating | UL94 | VHB |
Remarks: It is available to modify viscosity/color/curing time following specific requirement from customers.
