GTP-CP500 Advanced Thermal Pad
Description
Based on the advanced orientation technology, GTPCP500 exhibits outstanding physical and chemical reliable performance in aspect of thermal conduction and EMI suppression performance. Owing to its vertically aligned carbon fibers, it can create an outstanding heat path across all the contact surface to achieve the most advanced cooling in structural designs. It can also be made in ultra-thin pad to optimize the thermal resistance with lower compressions.
Features & Benefits
- Superior thermal conductivity: 50W/m.K
- Good EMI suppression and thermal conduction
- Low outgassing, durable aging performance
- Low stress required for assembly
- Good workability and ultra-thin offering
- Wide range of thickness options
Good thermal stability
Typical Applications
- Photovoltaic modules, IGBT modules
- Chip packaging
- Telecommunication equipment, 5G module units
- Military gadgets, radar, power inverters
Large-scale storage devices
Remarks:
1. Shelf-life can be 24 months since date of
manufacture
2. Supply form: Sheet, die-cut/kiss-cut parts or
Screen-printed adhesive, etc.
3. Standard sheet size: 100x100mm
More Details
- Data Sheet
| Item | Unit | GTP-CP500 | Standards | |
| PHYSICAL | Color | – | Black | Visual |
| Thickness | mm | 0.3 | ASTM D374 | |
| Hardness | Shore 00 | HYSI | ASTM D2240 | |
| Density | g/cc | 2.5 | ASTM D792 | |
| Elongation | % | ≥50 | ASTM D412 | |
| Tensile Strength | MPa | ≥0.5 | ASTM D412 | |
| Dielectric Strength | KV/mm | <1.0 | ASTM D149 | |
| Breakdown voltage | KV/mm | <1.0 | ASTM D149 | |
| Volume Resistivity | Ω-cm | 1.0×10⁶ | ASTM D257 | |
| TGA Weight Loss | wt% | <0.5 | 150°C Cx24hrs | |
| Operating Temp. | °C | -50 ~ 150 | – | |
| Flammability | – | V0 | UL94 | |
| THERMAL | Thermal Conductivity | W/m.K | 50 | ASTM D5470 |
| Thermal impedance @ 10psi / 0.3mm | °C-in²/W | 0.047 | ASTM D5470 | |
| Thermal impedance @ 40psi / 0.3mm | °C-in²/W | 0.028 | ASTM D5470 |
