GTP-CP900 Advanced Thermal Pad

Based on the advanced orientation technology, GTPCP900 exhibits outstanding physical and chemical reliable performance in aspect of thermal conduction and EMI suppression performance. With its innovated formulation and crosslinking structure, it can well bridge the gaps between components and it won’t degrade its performance even under high compression set in severe conditions than the traditional carbon fiber gap pad. Also, it exhibits good resilience and low deflection force causing the bent issue when assembly.

Features & Benefits

• Superior thermal conductivity: 90W/m.K
• Good EMI suppression and thermal conduction
• Low outgassing, durable aging performance
• Low stress required for assembly
• High performance option for TIM1 / TIM2
• Good option to replace grease, liquid metal etc.

Typical Applications

• Photovoltaic modules, IGBT modules
• Chip packaging
• Telecommunication equipment, 5G module units
• Military gadgets, radar, power inverters
• Large-scale storage devices, servers

Remarks:

1. Shelf-life can be 12 months since date of manufacture
2. Supply form: Sheet, die-cut/kiss-cut parts or Screen-printed adhesive, etc.
3. Standard sheet size: 90x90mm

Note:
Other thickness options can be customized but additional tooling cost will be taken into charges against the volume production stage. In prototype stage, it can be made without tooling in size 40x40mm only.