GTP-GEL025-NS Sil-Free Thermal Gap Filler
Description
GTP-GEL025-NS is 2-part silicone-free thermal gap filler which is designed for silicone-sensitive and stress-sensitive applications. It exhibits excellent low modulus properties and cures to a soft, flexible elastomer to help relieve the stress when compressed. The mixture compound will cure at ambient temperature and it can be naturally tacky surface to eliminate the air voids in between with low stresses for components in operations.
Features & Benefits
- Superior thermal conductivity: 2.5W/m.K
- Ultra-conforming, designed for fragile and low-stress applications
- No silicone outgassing or extraction
- High deflection and low assembly stress obtained
- Good wetting surface & reworkable
Typical Applications
- Laser equipment, routers and wireless infrastructures
- Automotive, EV battery packs
- LED lighting
- Telecommunication equipment, 5G module units
- Surveillance camera / system
- Signal transmitter, medical devices
Remarks:
- Shelf-life can be 12 months since date of manufacturing
- Available packaging (others can be satisfied upon request
| Type | Option |
| Syringe | 100/400/1000cc(1:1) |
| Pail/Drum | 20 Litre |
More Details
- Data Sheet
| Item | Unit | GTP-GEL025-NS | Standards | |
| PHYSICAL | Color (A/B/Post-cure) | – | White / Pink / Lt. Pink | Visual |
| Mixing Ratio | – | 1:1 | Mass ratio | |
| Flow Rate @ 90psi | g/min | ≥30 | Φ2.41mm EFD syringe | |
| Density | g/cc | 2.8 | ASTM D792 | |
| Minimal BLT | um | 150 | – | |
| Tack-free Time | Min | 180 | @25°C | |
| Fully-cured Time | H | 8 | @25°C | |
| Accelerated Curing | Min | 10 | @100°C | |
| Post Cured Properties | ||||
| Dielectric Strength | KV/mm | >8.0 | ASTM D149 | |
| Breakdown voltage | KV/mm | >10.0 | ASTM D149 | |
| Hardness | Shore 00 | 55(±5) | ASTM D5470 | |
| Volume Resistivity | Ω-cm | 1.0×10¹² | ASTM D257 | |
| TGA Weight Loss | wt% | <1.0 | 150°C Cx24hrs | |
| Operating Temp. (Cont.) | °C | -40 ~ 125 | – | |
| Flammability | – | VO | UL94 | |
| THERMAL | Thermal Conductivity | W/m.K | 2.5 | ASTM D5470 |
| Thermal impedance @ 20psi / 0.3mm | °C-in²/W | 0.34 | ASTM D5470 |
