GTP-GS200-NS Non-Silicone Thermal Grease
Description
GTP-GS200 is a type of silicone free thermal conductive paste for maintaining its high performance whilst avoiding the silicone-sensitive applications. It exhibits excellent cooling performance and keeps in a wet mating surface to minimize the impact of increasing thermal impedances due to the vaporizing / outgassing under stable or accelerated heat conditions.
Features & Benefits
- Outstanding thermal conductivity: 2.0W/m.K
- Silicone free, low outgassing
- Ultra low bond-line thickness (BLT)
- Low viscosity and suitable for screen printing
- No corrosion or oxidation to any contact surfaces
- Good wetting surface and no dry-out
Typical Applications
- Laser equipment, routers and wireless infrastructures
- High power density LED module
- Power supplies, power transistors
- Telecommunication equipment, 5G module units
- Military gadgets, radar, power inverters
- Signal transmitter, PC peripherals, overclock systems
Remarks:
- Shelf-life can be 24 months since date of manufacturing
- Available packaging (others can be satisfied upon request)
| Mini-pack | 0.5-5g |
| Syringe | 0.5-30g |
| Plastic / Aluminum can | 30g – 10kgs |
More Details
- Data Sheet
| Item | Unit | GTP-GS200-NS | Standards | |
| PHYSICAL | Color | – | Gray | Visual |
| Viscosity | Pa/s | 300 | Brookfield Rvf#7 | |
| Thixotropic Index | 1/10mm | 230+/-10 | – | |
| Density | g/cc | 2.8 | ASTM D792 | |
| Minimal BLT | um | 50 | – | |
| Dielectric Strength | KV/mm | >5.0 | ASTM D149 | |
| Breakdown voltage | KV/mm | >6.0 | ASTM D149 | |
| Volume Resistivity | Ω-cm | 1.0×10¹³ | ASTM D257 | |
| TGA Weight Loss | wt% | <0.15 | 150°Cx24hrs | |
| Transient Operating Temp. | °C | -55 ~ 180 | – | |
| Continuous Operating Temp. | °C | -40 ~ 150 | – | |
| Flammability | – | VO | UL94 | |
| THERMAL | Thermal Conductivity | W/m.K | 2 | ASTM D5470 |
| Thermal impedance @ 40psi / 0.08mm | °C-in²/W | 0.082 | ASTM D5470 |
