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GTP-ING100 Premium Liquid Metal Pad

Description

GTP-ING100 is a highly conformable / thermally conductive co-polymer liquid metal gap pad. It can exhibit ultra-low thermal impedance to improve system capability and it can also perform high reliability in severe aging conditions. It is designed with liquid metal (LM) as core base material and it utilizes state-of-the-art manufacturing technology to form this non-leaking premium LM pad. Owning to its intrinsic metallic property, it can be well bridging the irregular gap voids under lower required compression force after heating up to 60°C. It can be a good alternative to thermal paste in high-end applications.

Features & Benefits

  •  Superior thermal conductivity: 110W/m.K
  •  Ultra-low thermal impedance
  •  Low volatile emission
  •  No leaking in working condition
  •  Outstanding thermal stability
  •  Good physical property and easy for handling

Typical Applications

  • Applicable for TIM1 & TIM2 packaging
  • Laser equipment
  • Telecom power inverter
  • High power density applications
  • Data centers, server units

Remarks:

  1. Shelf-life can be 12 months since date of manufacture
  2. Supply form: Sheet, die-cut/kiss-cut parts or
  3. Standard sheet size: 80x80mm
  4. Suggested storage condition
  • Temperature / RH≤25°C / 60%
More Details
ItemUnitGTP-ING100Standards
PHYSICALColorSilverVisual
Thicknessmm0.1-0.3ASTM D374
Melting point°C60GB/T 1425-1996
Densityg/cc7ASTM D792
Tensile StrengthMpa>8.5ASTM D412
Compression set @50psi%>30ASTM D149
TGA Weight Losswt%<0.1150°C Cx24hrs
Operating Temp.°C-45 ~ 500
Corrosion RatingAL/CUGoodGALLOP standard
THERMALThermal ConductivityW/m.K110ASTM D5470
Thermal impedance @ 10psi / 0.1mm°C-cm²/W≤0.05ASTM D5470
Thermal impedance @ 50psi / 0.1mm°C-cm²/W≤0.04ASTM D5470

 

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