GTP-INS010 Indium Thermal Pad
Description
GTP-INS010 is a pure indium high performance gap pad. It can exhibit ultra-low thermal impedance to improve system capability and it can also perform high reliability in severe aging conditions. It helps make assembly without contamination and messes up the thermal grease for most applications. This advanced material performs well in terms of its physical and chemical stability. It can also be suitable for the reflow solder process etc.
Features & Benefits
- Superior thermal conductivity: 86W/m.K
- Low thermal impedance
- Low volatile emission and non-toxic
- Compatible with all types of organic cooling liquids
- Can be melting at specific temperature range
- Outstanding thermal stability
- Good physical property and easy for handling
Typical Applications
- Applicable for TIM1 & TIM2 packaging
- Laser equipment
- Network terminals
- High power density applications
- LED lighting, consumer electronics and gaming gears
Remarks:
- Shelf-life can be 12 months since date of manufacture
- Supply form: Sheet, die-cut/kiss-cut parts or
- Standard sheet size: 80x80mm
- Suggested storage condition
- Temperature / RH≤25°C / 60%
More Details
- Data Sheet
| Item | Unit | GTP-INS010 | Standards | |
| PHYSICAL | Color | – | Silver | Visual |
| Thickness | mm | 0.1-0.3 | ASTM D374 | |
| Melting point | °C | 150 | GB/T 1425-1996 | |
| Density | g/cc | 7.31 | ASTM D792 | |
| Brinell Hardness | – | 89 | ASTM E10 | |
| Volume resistance | Ohm-m | 8.4×10-⁸ | GB/T 6146-2010 | |
| Tensile Strength | PSI | 273 | ASTM D412 | |
| Shear Strength | PSI | 890 | ASTM D412 | |
| TGA Weight Loss | wt% | <0.001 | 150°C Cx24hrs | |
| Operating Temp. | °C | -50 ~ 500 | – | |
| Corrosion Rating | AL/CU | Good | GALLOP standard | |
| THERMAL | Thermal Conductivity | W/m.K | >86 | ASTM D5470 |
| Thermal impedance @ 10psi / 0.1mm | °C-cm²/W | ≤0.12 | ASTM D5470 | |
| Thermal impedance @ 50psi / 0.1mm | °C-cm²/W | ≤0.08 | ASTM D5470 |
Remarks: Customizable for melting point, thickness etc.
