GTP170 Advanced Thermal Pad
Description
Based on the advanced formulation technology, GTP170 exhibits outstanding physical and chemical reliable performance in aspect of thermal conduction and lower compression set, etc. Owing to its intrinsic adhesion and soft polymer structures, it can be well bridging the irregular gap voids to optimize the heat dissipation without sacrificing thermal performance by laminating with additional adhesives or other surface treatment.
Features & Benefits
- Superior thermal conductivity: 17W/m.K
- High insulation compatibility
- Low outgassing, durable aging performance
- High inflation and flexibility
- Good workability and ultra-thin offering
- Wide range of thickness options
- Cost-saving solutions
Typical Applications
- Laser equipment
- High power density LED module
- Power supplies, UPS
- Telecommunication equipment, 5G module units
- Military gadgets, radar, power inverters
- Signal transmitter, PC peripherals
Remarks:
- Shelf-life can be 24 months since date of manufacture
- Supply form: Sheet, die-cut/kiss-cut parts or prelaminated with adhesive, etc.
- Standard sheet size: 300x400mm
More Details
- Data Sheet
| Item | Unit | GTP170 | Standards | |
PHYSICAL | Color | – | Dark Gray | Visual |
| Thickness | mm | 0.5-3.0 | ASTM D374 | |
| Hardness | Shore 00 | 50-70 | ASTM D2240 | |
| Density | g/cc | 3.5 | ASTM D792 | |
| Elongation | % | 45 | ASTM D412 | |
| Tensile Strength | Psi | <7.5 | ASTM D412 | |
| Dielectric Strength | KV/mm | >5.0 | ASTM D149 | |
| Breakdown voltage | KV/mm | >6.5 | ASTM D149 | |
| Volume Resistivity | Ω-cm | 1.8×10¹⁵ | ASTM D257 | |
| TGA Weight Loss | wt% | <0.5 | 150°C x 24hrs | |
| Operating Temp. | °C | -50 ~ 150 | – | |
| Flammability | – | V0 | UL94 | |
THERMAL | Thermal Conductivity | W/m.K | 17 | ASTM D5470 |
| Thermal impedance @ 10psi / 1mm | °C-in2/W | 0.121 | ASTM D5470 | |
| Thermal impedance @ 20psi / 1mm | °C-in2/W | 0.108 | ASTM D5470 |
